DMT32M5LPS
Maximum Ratings (@TC = +25°C, unless otherwise specified.)
Characteristic
Drain-Source Voltage
Symbol
VDSS
Value
30
Unit
V
Gate-Source Voltage
±20
V
VGSS
Steady
State
TC = +25C
TC = +70C
150
120
A
Continuous Drain Current, VGS = 10V (Note 6)
ID
Maximum Continuous Body Diode Forward Current (Note 6)
80
350
350
50
A
A
IS
Pulsed Drain Current (10μs Pulse, Duty Cycle = 1%)
IDM
ISM
IAS
EAS
Pulsed Body Diode Forward Current (10μs Pulse, Duty Cycle = 1%)
Avalanche Current, L = 0.1mH
A
A
Avalanche Energy, L = 0.1mH
140
mJ
Thermal Characteristics (@TC = +25°C, unless otherwise specified.)
Characteristic
Symbol
PD
Value
3.2
Unit
W
Total Power Dissipation (Note 5)
TA = +25°C
TC = +25°C
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 6)
54
°C/W
W
RJA
100
1.5
PD
Thermal Resistance, Junction to Case (Note 6)
Operating and Storage Temperature Range
°C/W
RJC
-55 to +150
°C
TJ, TSTG
Electrical Characteristics (@TC = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
Symbol
Min
Typ
Max
Unit
Test Condition
30
—
—
—
—
—
—
1
V
BVDSS
IDSS
VGS = 0V, ID = 250μA
VDS = 24V, VGS = 0V
VGS = ±16V, VDS = 0V
μA
nA
±100
IGSS
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
1
—
3
V
mΩ
V
VGS(TH)
RDS(ON)
VSD
VDS = VGS, ID = 1mA
VGS = 10V, ID = 30A
VGS = 4.5V, ID = 30A
VGS = 0V, IS = 30A
—
—
—
1.6
2.3
0.8
2.0
3.0
1.1
Static Drain-Source On-Resistance
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
3944
1267
186
0.6
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Ciss
Coss
Crss
Rg
VDS = 25V, VGS = 0V,
f = 1MHz
Output Capacitance
pF
Reverse Transfer Capacitance
Gate Resistance
Ω
VDS = 0V, VGS = 0V, f = 1MHz
34
Total Gate Charge (VGS = 4.5V)
Total Gate Charge (VGS = 10V)
Gate-Source Charge
Qg
68
Qg
nC
ns
VDS = 15V, ID = 20A
8
Qgs
Qgd
tD(ON)
tR
Gate-Drain Charge
15
Turn-On Delay Time
7.2
Turn-On Rise Time
13.2
37.5
23.9
28.7
45.8
VDD = 15V, VGS = 10V,
ID = 15A, RG = 3Ω
Turn-Off Delay Time
tD(OFF)
tF
Turn-Off Fall Time
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
ns
tRR
IS = 15A, di/dt = 500A/μs
nC
QRR
Notes:
5. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate.
6. Thermal resistance from junction to soldering point (on the exposed drain pad).
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to production testing.
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www.diodes.com
May 2023
DMT32M5LPS
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Document number: DS39663 Rev. 4 - 2