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DM2202J-15I PDF预览

DM2202J-15I

更新时间: 2024-01-29 16:06:07
品牌 Logo 应用领域
铁电 - RAMTRON 动态存储器光电二极管内存集成电路
页数 文件大小 规格书
19页 156K
描述
Cache DRAM, 1MX4, 15ns, CMOS, PDSO28

DM2202J-15I 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:SOJ, SOJ28,.34Reach Compliance Code:compliant
风险等级:5.92最长访问时间:15 ns
I/O 类型:COMMONJESD-30 代码:R-PDSO-J28
内存密度:4194304 bit内存集成电路类型:CACHE DRAM
内存宽度:4端子数量:28
字数:1048576 words字数代码:1000000
最高工作温度:85 °C最低工作温度:-40 °C
组织:1MX4输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:SOJ
封装等效代码:SOJ28,.34封装形状:RECTANGULAR
封装形式:SMALL OUTLINE电源:5 V
认证状态:Not Qualified刷新周期:1024
自我刷新:NO最大待机电流:0.001 A
子类别:DRAMs最大压摆率:0.18 mA
标称供电电压 (Vsup):5 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:J BEND端子节距:1.27 mm
端子位置:DUAL

DM2202J-15I 数据手册

 浏览型号DM2202J-15I的Datasheet PDF文件第1页浏览型号DM2202J-15I的Datasheet PDF文件第3页浏览型号DM2202J-15I的Datasheet PDF文件第4页浏览型号DM2202J-15I的Datasheet PDF文件第5页浏览型号DM2202J-15I的Datasheet PDF文件第6页浏览型号DM2202J-15I的Datasheet PDF文件第7页 
coherency. The EDRAM delivers 12ns cycle page mode memory  
writes. Memory writes do not affect the contents of the cache row  
register except during a cache hit.  
By integrating the SRAM cache as row registers in the DRAM  
array and keeping the on-chip control simple, the EDRAM is able  
to provide superior performance over standard slow 4Mb DRAMs.  
By eliminating the need for SRAMs and cache controllers, system  
cost, board space, and power can all be reduced.  
providing new column addresses to the multiplex address inputs.  
New data is available at the output at time tAC after each column  
address change. During read cycles, it is possible to operate in  
either static column mode with /CAL=high or page mode with /CAL  
clocked to latch the column address. In page mode, data valid  
time is determined by either tAC or tCQV  
.
DRAM Read Miss  
A DRAM read request is initiated by clocking /RE with W/R low  
and /F & /CAL high. The EDRAM compares the new row address to  
the LRR address latch (an 11-bit latch loaded on each /RE active  
read miss cycle). If the row address does not match the LRR, the  
requested data is not in SRAM cache and a new row must be  
fetched from the DRAM. The EDRAM will load the new row data  
into the SRAM cache and update the LRR latch. The data at the  
specified column address is available at the output pins at the  
greater of times tRAC, tAC, and tGQV. It is possible to bring /RE high  
after time tRE since the new row data is safely latched into SRAM  
cache. This allows the EDRAM to precharge the DRAM array while  
data is accessed from SRAM cache. It is possible to access additional  
SRAM cache locations by providing new column addresses to the  
multiplex address inputs. New data is available at the output at time  
tAC after each column address change. During read cycles, it is  
possible to operate in either static column mode with /CAL=high or  
page mode with /CAL clocked to latch the column address. In page  
Functional Description  
The EDRAM is designed to provide optimum memory  
performance with high speed microprocessors. As a result, it is  
possible to perform simultaneous operations to the DRAM and  
SRAM cache sections of the EDRAM. This feature allows the EDRAM  
to hide precharge and refresh operation during SRAM cache reads  
and maximize SRAM cache hit rate by maintaining valid cache  
contents during write operations even if data is written to another  
memory page. These new functions, in conjunction with the faster  
basic DRAM and cache speeds of the EDRAM, minimize processor  
wait states.  
EDRAM Basic Operating Modes  
The EDRAM operating modes are specified in the table below.  
Hit and Miss Terminology  
mode, data valid time is determined by either tAC or tCQV.  
In this datasheet, “hit” and “miss” always refer to a hit or miss  
to the page of data contained in the SRAM cache row register. This  
is always equal to the contents of the last row that was read from  
(as modified by any write hit data). Writing to a new page does not  
cause the cache to be modified.  
DRAM Write Hit  
If a DRAM write request is initiated by clocking /RE while W/R,  
/CAL, /WE, and /F are high, the EDRAM will compare the new row  
address to the LRR address latch (an 11-bit address latch loaded  
on each /RE active read miss cycle). If the row address matches,  
the EDRAM will write data to both the DRAM array and selected  
SRAM cache simultaneously to maintain coherency. The write  
address and data are posted to the DRAM as soon as the column  
address is latched by bringing /CAL low and the write data is  
latched by bringing /WE low. The write address and data can be  
latched very quickly after the fall of /RE (tRAH + tASC for the column  
address and tDS for the data). During a write burst sequence, the  
second write data can be posted at time tRSW after /RE. Subsequent  
writes within a page can occur with write cycle time tPC. With /G  
enabled and /WE disabled, it is possible to perform cache read  
operations while the /RE is activated in write hit mode. This allows  
DRAM Read Hit  
A DRAM read request is initiated by clocking /RE with W/R low  
and /F & /CAL high. The EDRAM compares the new row address to  
the last row read address latch (LRR - an 11-bit latch loaded on  
each /RE active read miss cycle). If the row address matches the  
LRR, the requested data is already in the SRAM cache and no  
DRAM memory reference is initiated. The data specified by the  
column address is available at the output pins at the greater of  
times tAC or tGQV. Since no DRAM activity is initiated, /RE can be  
brought high after time tRE1, and a shorter precharge time, tRP1, is  
allowed. It is possible to access additional SRAM cache locations by  
EDRAM Basic Operating Modes  
Function  
/S  
L
L
L
L
X
/RE  
W/R  
L
/F  
H
H
H
H
L
/CAL /WE  
A
Comment  
0-10  
Read Hit  
H
H
H
H
X
X
X
H
H
X
Row = LRR  
Row LRR  
Row = LRR  
Row LRR  
X
No DRAM Reference, Data in Cache  
DRAM Row to Cache  
Read Miss  
Write Hit  
L
H
Write to DRAM and Cache, Reads Enabled  
Write to DRAM, Cache Not Updated, Reads Disabled  
Cache Reads Enabled  
Write Miss  
Internal Refresh  
H
X
Low Power Standby  
Unallowed Mode  
H
H
H
H
L
X
X
H
X
H
H
H
X
L
H
X
H
X
X
X
1mA Standby Current  
Unallowed Mode (Except -L Option)  
Standby Current, Internal Refresh Clock (-L Option)  
Low Power Self-Refresh  
Option  
H = High; L = Low; X = Don’t Care; = High-to-Low Transition; LRR = Last Row Read  
1-20  

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