D44H Series (NPN),
D45H Series (PNP)
Preferred Devices
Complementary Silicon
Power Transistors
These series of plastic, silicon NPN and PNP power transistors can
be used as ꢀgeneral purpose power amplification and switching such
as output or driver stages in applications such as switching regulators,
converters and power amplifiers.
http://onsemi.com
10 AMP COMPLEMENTARY
SILICON POWER
Features
•ꢁLow Collector-Emitter Saturation Voltage
TRANSISTORS 60, 80 VOLTS
V
CE(sat)
= 1.0 V (Max) @ 8.0 A
•ꢁFast Switching Speeds
•ꢁComplementary Pairs Simplifies Designs
•ꢁPb-Free Packages are Available*
MARKING
DIAGRAM
4
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
TO-220AB
CASE 221A-09
STYLE 1
D4xHyyG
AYWW
Collector-Emitter Voltage
D44H8, D45H8
D44H11, D45H11
V
CEO
Vdc
60
80
1
2
3
Emitter Base Voltage
V
5.0
Vdc
Adc
EB
D4xHyy = Device Code
x = 4 or 5
yy = 8 or 11
Collector Current
- Continuous
- Peak (Note 1)
I
C
10
20
A
= Assembly Location
= Year
= Work Week
Y
Total Power Dissipation
@ T = 25°C
P
D
W
WW
G
70
2.0
C
= Pb-Free Package
@ T = 25°C
A
Operating and Storage Junction
Temperature Range
T , T
J
-55 to +150
°C
stg
ORDERING INFORMATION
†
50 Units/Rail
50 Units/Rail
THERMAL CHARACTERISTICS
Characteristic
Device
Package
Shipping
Symbol
Max
1.8
Unit
°C/W
°C/W
°C
D44H8
TO-220
Thermal Resistance, Junction-to-Case
Thermal Resistance, Junction-to-Ambient
R
q
JC
D44H8G
TO-220
(Pb-Free)
R
q
JA
62.5
275
D44H11
TO-220
50 Units/Rail
50 Units/Rail
Maximum Lead Temperature for Soldering
Purposes: 1/8″ from Case for 5 Seconds
T
L
D44H11G
TO-220
(Pb-Free)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Pulse Width v 6.0 ms, Duty Cycle v 50%.
D45H8
TO-220
50 Units/Rail
50 Units/Rail
D45H8G
TO-220
(Pb-Free)
D45H11
TO-220
50 Units/Rail
50 Units/Rail
D45H11G
TO-220
(Pb-Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb-Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Preferred devices are recommended choices for future use
and best overall value.
©ꢀ Semiconductor Components Industries, LLC, 2007
November, 2007 - Rev. 10
1
Publication Order Number:
D44H/D