Datasheet > CYBT-223058-02

CYBT-223058-02

更新时间： 2024-11-06 14:56:19

品牌	Logo	应用领域
英飞凌 - INFINEON		/
页数	文件大小	规格书
62页	1100K
描述
Infineon’s AIROC? CYBT-223058-02 is a fully certified Bluetooth? and Bluetooth? LE module based on Infineon’s CYW20819. This embedded module is available in 11x11x1.7mm SMT form-factor.

阅读下载

中文翻译

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

CYBT-223058-02 数据手册

CYBT-223058-02, CYBT-253059-02

AIROC™ Bluetooth® & Bluetooth® LE module

General description

The CYBT-2x305x-02 is a dual-mode Bluetooth® BR/EDR and Low Energy wireless module solution. The

CYBT-223058-02 includes an onboard crystal oscillator, passive components, and the Infineon CYW20819 silicon

device. The CYBT-253059-02 includes an onboard crystal oscillator, passive components, and the Infineon

CYW20820 silicon device.

The CYBT-2x305x-02 supports a number of peripheral functions (ADC, PWM), as well as multiple serial

communication protocols (UART, SPI, I²C, I²S/PCM). The CYBT-2x305x-02 includes a royalty-free stack

compatible with Bluetooth® 5.0 in a small 11.0 ×11.00 × 1.70 mm module form-factor.

The CYBT-2x305x-02 includes 256 KB of on-chip flash memory and is designed for standalone operation. The

CYBT-2x305x-02 uses an integrated power amplifier to achieve Class I or Class II output power capability.

The CYBT-2x305x-02 includes an integrated chip antenna, is qualified by Bluetooth® SIG, and includes regulatory

certification approval for FCC, ISED, MIC, and CE.

Features

• Module description

- Module size: 11.00 mm × 11.00 mm × 1.70 mm

- Complies with Bluetooth® Core Specification version 5.0 and includes support for BR, EDR 2/3 Mbps, eSCO,

Bluetooth LE, LE 2 Mbps, as well as Bluetooth® Mesh.

• QDID: 158813

• Declaration ID: D052875

- Certified to FCC, ISED, MIC, and CE standards

- 256-KB on-chip Flash, 176-KB on-chip RAM

- Industrial temperature range: –30°C to +85°C

- Integrated Arm® Cortex®-M4 microprocessor core with floating point unit (FPU)

• RF characteristics

- Maximum TX output power: +4.0 dBm (CYBT-223058-02); +10.5 dBm (CYBT-253059-02)

- Bluetooth® LE RX Receive Sensitivity: –94.5 dBm

• Power consumption

- TX current consumption

• Bluetooth® LE silicon: 5.8 mA (radio only, 4 dBm) (CYBT-223058-02); 22 mA (radio only, 10.5 dBm)

(CYBT-253059-02)

- RX current consumption

• Bluetooth® silicon: 5.9 mA (radio only)

- Infineon CYW20819/20 silicon low power mode support

• PDS: 16.5 µA with 176 KB RAM retention

• ePDS: 8.7 µA

• HIDOFF (wake on external or timed interrupt): 1.75 µA

Datasheet

www.infineon.com

Please read the Important Notice and Warnings at the end of this document

page 1

002-29172 Rev. *C

2023-06-08

12 3 4 5 6 7...62

中文翻译

下载PDF

与CYBT-223058-02相关器件

型号	品牌	获取价格	描述	数据表
CYBT-243053-02	INFINEON	获取价格	Infineon’s AIROC? CYBT-243053-02 is a fully c
CYBT-253059-02	INFINEON	获取价格	AIROC?蓝牙?模块
CYBT-263064-02	INFINEON	获取价格	Infineon’s AIROC? CYBT-263064-02 is a fully c
CYBT-263065-02	INFINEON	获取价格	Infineon’s AIROC? CYBT-263065-02 is a fully c
CYBT-273063-02	INFINEON	获取价格	Infineon’s AIROC? CYBT-273063-02 is a fully c
CYBT-333032-02	INFINEON	获取价格	AIROC?蓝牙?模块
CYBT-343026-01	INFINEON	获取价格	Infineon’s AIROC? CYBT-343026-01 is a fully c
CYBT-343151-02	INFINEON	获取价格	AIROC™蓝牙®模块
CYBT-353027-02	INFINEON	获取价格	Infineon’s AIROC? CYBT-353027-02 is a fully c
CYBT-413055-02	INFINEON	获取价格	Infineon’s AIROC? CYBT-413055-02 is a fully c

与CYBT-223058-02相关文章

英伟达新AI芯片Rubin或提前半年亮相
2024-11-05

13
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
2024-11-05

9
三星深化印度制造布局，供应链本地化进程加速
2024-10-29

35
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
2024-10-29

31

产品中心

服务支持

精选活动

关于我们

帮助中心

CYBT-223058-02

CYBT-223058-02 数据手册

与CYBT-223058-02相关器件

与CYBT-223058-02相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

CYBT-223058-02

CYBT-223058-02 数据手册

与CYBT-223058-02相关器件

与CYBT-223058-02相关文章

您还可以找

您在本页遇到什么问题？