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CYBT-253059-02 PDF预览

CYBT-253059-02

更新时间： 2024-11-06 14:56:19
品牌 Logo 应用领域
英飞凌 - INFINEON 蓝牙
页数 文件大小 规格书
62页 1100K
描述
AIROC?蓝牙?模块

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CYBT-253059-02 数据手册

 浏览型号CYBT-253059-02的Datasheet PDF文件第2页浏览型号CYBT-253059-02的Datasheet PDF文件第3页浏览型号CYBT-253059-02的Datasheet PDF文件第4页浏览型号CYBT-253059-02的Datasheet PDF文件第5页浏览型号CYBT-253059-02的Datasheet PDF文件第6页浏览型号CYBT-253059-02的Datasheet PDF文件第7页 
CYBT-223058-02, CYBT-253059-02  
AIROC™ Bluetooth® & Bluetooth® LE module  
General description  
The CYBT-2x305x-02 is a dual-mode Bluetooth® BR/EDR and Low Energy wireless module solution. The  
CYBT-223058-02 includes an onboard crystal oscillator, passive components, and the Infineon CYW20819 silicon  
device. The CYBT-253059-02 includes an onboard crystal oscillator, passive components, and the Infineon  
CYW20820 silicon device.  
The CYBT-2x305x-02 supports a number of peripheral functions (ADC, PWM), as well as multiple serial  
communication protocols (UART, SPI, I2C, I2S/PCM). The CYBT-2x305x-02 includes a royalty-free stack  
compatible with Bluetooth® 5.0 in a small 11.0 ×11.00 × 1.70 mm module form-factor.  
The CYBT-2x305x-02 includes 256 KB of on-chip flash memory and is designed for standalone operation. The  
CYBT-2x305x-02 uses an integrated power amplifier to achieve Class I or Class II output power capability.  
The CYBT-2x305x-02 includes an integrated chip antenna, is qualified by Bluetooth® SIG, and includes regulatory  
certification approval for FCC, ISED, MIC, and CE.  
Features  
• Module description  
- Module size: 11.00 mm × 11.00 mm × 1.70 mm  
- Complies with Bluetooth® Core Specification version 5.0 and includes support for BR, EDR 2/3 Mbps, eSCO,  
Bluetooth LE, LE 2 Mbps, as well as Bluetooth® Mesh.  
• QDID: 158813  
• Declaration ID: D052875  
- Certified to FCC, ISED, MIC, and CE standards  
- 256-KB on-chip Flash, 176-KB on-chip RAM  
- Industrial temperature range: –30°C to +85°C  
- Integrated Arm® Cortex®-M4 microprocessor core with floating point unit (FPU)  
• RF characteristics  
- Maximum TX output power: +4.0 dBm (CYBT-223058-02); +10.5 dBm (CYBT-253059-02)  
- Bluetooth® LE RX Receive Sensitivity: –94.5 dBm  
• Power consumption  
- TX current consumption  
• Bluetooth® LE silicon: 5.8 mA (radio only, 4 dBm) (CYBT-223058-02); 22 mA (radio only, 10.5 dBm)  
(CYBT-253059-02)  
- RX current consumption  
• Bluetooth® silicon: 5.9 mA (radio only)  
- Infineon CYW20819/20 silicon low power mode support  
• PDS: 16.5 µA with 176 KB RAM retention  
• ePDS: 8.7 µA  
• HIDOFF (wake on external or timed interrupt): 1.75 µA  
Datasheet  
www.infineon.com  
Please read the Important Notice and Warnings at the end of this document  
page 1  
002-29172 Rev. *C  
2023-06-08  
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