Datasheet > CYBLE-333073-02

CYBLE-333073-02

更新时间： 2024-11-28 14:54:39

品牌	Logo	应用领域
英飞凌 - INFINEON		蓝牙
页数	文件大小	规格书
58页	863K
描述
AIROC?蓝牙?模块

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中文翻译

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数据手册

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CYBLE-333073-02 数据手册

CYBLE-343072-02, CYBLE-333073-02,

CYBLE-333074-02

AIROC™ Bluetooth® LE module

General description

The CYBLE-3x307x-02 is a fully integrated Bluetooth® smart ready wireless module. The CYBLE-3x307x-02

includes an onboard crystal oscillator, passive components, flash memory, and the CYW20835 silicon device.

Refer to the CYW20835 datasheet for additional details on the capabilities of the silicon device used in this

module.

The CYBLE-3x307x-02 supports peripheral functions (ADC and PWM), UART, I²C, and SPI communication, and a

PCM/I²S audio interface. The CYBLE-3x307x-02 includes a royalty-free Bluetooth® stack compatible with

Bluetooth® 5.0 in a 13.31 × 21.89 × 1.95 mm package.

The CYBLE-3x307x-02 includes 512 KB of onboard serial flash memory and is designed for standalone operation.

The CYBLE-3x307x-02 uses an integrated power amplifier to achieve Class I or Class II output power capability.

The CYBLE-3x307x-02 is fully qualified by Bluetooth® SIG and is targeted at applications requiring cost-optimized

Bluetooth® wireless connectivity.

The CYBLE-3x307x-02 is offered in four certified versions CYBLE-343072-02, CYBLE-333073-02, and

CYBLE-333074-02. The CYBLE-343072-02 includes an integrated trace antenna. The CYBLE-333073-02 supports

an external antenna through a RF solder pad output. The CYBLE-333074-02 supports an external antenna via a

u-FL connector.

Module description

• Module size: 13.31 × 21.89 × 1.95 mm

• Bluetooth® 5.0 qualified smart ready module

- QDID: TBD

- Declaration ID: TBD

• Certified to FCC, ISED, MIC, and CE regulations

• Castelated solder pad connections for ease-of-use

• 512-KB on-module serial flash memory

• Up to 24 GPIOs

• Temperature range: –30 °C to +85 °C

• Cortex-M4 32-bit processor

• Maximum TX output power

- +12 dBm for Bluetooth® Low Energy

• Bluetooth® LE connection range of up to 250 meters at 12 dBm^[1]

• RX receive sensitivity:

- Bluetooth® Low Energy: –94.5 dBm

Power consumption

• Bluetooth® LE current consumption

- RX current: 8 mA

- TX current: 18 mA @ 12 dBm

- Interval Bluetooth® LE ADV average current consumption: 30 µA

- HIDOFF (Deep Sleep): 1 µA

Functional capabilities

• 1x MIPI DMI-C interface

• 6x 16-bit PWMs

• Programmable key-scan matrix interface, up to 8 × 20 key scanning matrix

Preliminary Datasheet

www.infineon.com

Please read the Important Notice and Warnings at the end of this document

page 1 of 58

002-33419 Rev. **

2021-08-12

12 3 4 5 6 7...58

中文翻译

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与CYBLE-333073-02相关器件

型号	品牌	获取价格	描述	数据表
CYBLE-333074-02	INFINEON	获取价格	AIROC?蓝牙?模块
CYBLE-343072-02	INFINEON	获取价格	英飞凌AIROC? CYBLE-343072-02是基于英飞凌CYW20835的全面认证蓝
CYBLE-416045-02	INFINEON	获取价格	Infineon’s AIROC? CYBLE-416045-02 is a fully
CYBT-213043-02	INFINEON	获取价格	AIROC?蓝牙?模块
CYBT-223058-02	INFINEON	获取价格	Infineon’s AIROC? CYBT-223058-02 is a fully c
CYBT-243053-02	INFINEON	获取价格	Infineon’s AIROC? CYBT-243053-02 is a fully c
CYBT-253059-02	INFINEON	获取价格	AIROC?蓝牙?模块
CYBT-263064-02	INFINEON	获取价格	Infineon’s AIROC? CYBT-263064-02 is a fully c
CYBT-263065-02	INFINEON	获取价格	Infineon’s AIROC? CYBT-263065-02 is a fully c
CYBT-273063-02	INFINEON	获取价格	Infineon’s AIROC? CYBT-273063-02 is a fully c

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