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CY8C20247-24SXI PDF预览

CY8C20247-24SXI

更新时间: 2024-11-27 20:45:27
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 微控制器光电二极管外围集成电路
页数 文件大小 规格书
45页 757K
描述
Microprocessor Circuit, CMOS, PDSO16, 0.150 MM, LEAD FREE, MS-012, SOIC-16

CY8C20247-24SXI 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:SOIC
包装说明:SOP, SOP16,.25针数:16
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.31.00.01Factory Lead Time:1 week
风险等级:8.39位大小:8
CPU系列:M8CJESD-30 代码:R-PDSO-G16
JESD-609代码:e4长度:9.893 mm
湿度敏感等级:3端子数量:16
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装等效代码:SOP16,.25封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
电源:1.8/5 V认证状态:Not Qualified
RAM(字节):2048ROM(单词):16384
ROM可编程性:FLASH座面最大高度:1.727 mm
速度:25.2 MHz子类别:Microcontrollers
最大压摆率:4 mA最大供电电压:5.5 V
最小供电电压:1.71 V标称供电电压:3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:30
宽度:3.8985 mmuPs/uCs/外围集成电路类型:MICROPROCESSOR CIRCUIT
Base Number Matches:1

CY8C20247-24SXI 数据手册

 浏览型号CY8C20247-24SXI的Datasheet PDF文件第2页浏览型号CY8C20247-24SXI的Datasheet PDF文件第3页浏览型号CY8C20247-24SXI的Datasheet PDF文件第4页浏览型号CY8C20247-24SXI的Datasheet PDF文件第5页浏览型号CY8C20247-24SXI的Datasheet PDF文件第6页浏览型号CY8C20247-24SXI的Datasheet PDF文件第7页 
CY8C20xx7/S  
1.8 V CapSense® Controller with SmartSense™  
Auto-tuning 31 Buttons, 6 Sliders, Proximity Sensors  
1.8  
V CapSense® Controller with SmartSense™ Auto-tuning 31 Buttons, 6 Sliders, Proximity Sensors  
4 Clock Sources  
Features  
Internal main oscillator (IMO): 6/12/24 MHz  
Internal low-speed oscillator (ILO) at 32 kHz for watchdog  
QuietZone™ Controller  
Patented Capacitive Sigma Delta PLUS (CSD PLUS™)  
sensing algorithm for robust performance  
High Sensitivity (0.1 pF) and best-in-class SNR performance  
to support:  
and sleep timers  
External 32 KHz Crystal Oscillator  
External Clock Input  
Programmable pin configurations  
Up to 34 general-purpose I/Os (GPIOs)  
Dual mode GPIO (Analog and Digital)  
High sink current of 25 mA per GPIO  
• Max sink current 120 mA for all I/Os combined  
Source Current  
• 5 mA on ports 0 and 1  
• 1 mA on ports 2, 3 and 4  
Configurable internal pull-up, high-Z and open drain modes  
Selectable, regulated digital I/O on port 1  
Configurable input threshold on port 1  
• Overlay thickness of 15 mm for glass and 5 mm plastic  
• Proximity Solutions  
Superiornoiseimmunityperformanceagainstconductedand  
radiated noise and ultra low radiated emissions  
• Standardized user modules for overcoming noise  
Low power CapSense® block with SmartSense Auto-tuning  
Low average power consumption –  
• 28 µA/sensor in run time (wake-up and scan once every  
125 ms)  
SmartSense_EMC_PLUS Auto-Tuning  
• Sets and maintains optimal sensor performance during run  
time  
Versatile Analog functions  
Internal analog bus supports connection of multiple sensors  
• Eliminates system tuning during development and  
production  
• Compensates for variations in manufacturing process  
to form ganged proximity sensor  
Internal Low-Dropout voltage regulator for high power supply  
rejection ratio (PSRR)  
Driven shield available on five GPIO pins  
Delivers best-in class water tolerant designs  
Robust proximity sensing in the presence of metal objects  
Supports longer trace lengths  
Additional system resources  
I2C Slave:  
• Selectable to 50 kHz, 100 kHz, or 400 kHz  
• Selectable Clock stretch or Forced Nack Mode  
• I2C wake from sleep with Hardware address match  
12 MHz (Configurable) SPI master and slave  
Three 16-bit timers  
Max load of 100 pF (3 MHz)  
Powerful Harvard-architecture processor  
M8C CPU with a max speed of 24 MHz  
Watchdog and sleep timers  
Integrated supervisory circuit  
10-bit incremental analog-to-digital converter (ADC) with  
internal voltage reference  
Two general-purpose high speed, low power analog  
comparators  
Operating Range: 1.71 V to 5.5 V  
Standby Mode 1.1 μA (Typ)  
Deep Sleep 0.1 μA (Typ)  
Operating Temperature range: –40 oC to +85 oC  
Flexible on-chip memory  
Complete development tools  
8 KB flash, 1 KB SRAM  
16 KB flash, 2 KB SRAM  
Free development tool (PSoC Designer™)  
32 KB flash, 2 KB SRAM  
Sensor and Package options  
50,000 flash erase/write cycles  
Read while Write with EEPROM emulation  
In-system programming simplifies manufacturing process  
10 Sensing Inputs – 16-pin QFN, 16-pin SOIC  
16 Sensing Inputs – 24-pin QFN  
24 Sensing Inputs – 30-pin WLCSP  
25 Sensing Inputs – 32-pin QFN  
31 Sensing Inputs – 48-pin QFN  
Errata: For information on silicon errata, see “Errata” on page 37. Details include trigger conditions, devices affected, and proposed workaround.  
Cypress Semiconductor Corporation  
Document Number: 001-69257 Rev. *P  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised May 19, 2017  
 

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