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CY7C2665KV18-450BZI PDF预览

CY7C2665KV18-450BZI

更新时间: 2024-11-07 19:45:03
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 时钟静态存储器内存集成电路
页数 文件大小 规格书
31页 556K
描述
QDR SRAM, 4MX36, 0.45ns, CMOS, PBGA165, FBGA-165

CY7C2665KV18-450BZI 技术参数

是否Rohs认证: 不符合生命周期:Active
零件包装代码:BGA包装说明:LBGA, BGA165,11X15,40
针数:165Reach Compliance Code:compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
Factory Lead Time:1 week风险等级:2.48
最长访问时间:0.45 ns其他特性:PIPELINED ARCHITECTURE
最大时钟频率 (fCLK):450 MHzI/O 类型:SEPARATE
JESD-30 代码:R-PBGA-B165JESD-609代码:e0
长度:17 mm内存密度:150994944 bit
内存集成电路类型:QDR SRAM内存宽度:36
湿度敏感等级:3功能数量:1
端子数量:165字数:4194304 words
字数代码:4000000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:4MX36输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:LBGA
封装等效代码:BGA165,11X15,40封装形状:RECTANGULAR
封装形式:GRID ARRAY, LOW PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):220电源:1.5/1.8,1.8 V
认证状态:Not Qualified座面最大高度:1.4 mm
最大待机电流:0.46 A最小待机电流:1.7 V
子类别:SRAMs最大压摆率:1.29 mA
最大供电电压 (Vsup):1.9 V最小供电电压 (Vsup):1.7 V
标称供电电压 (Vsup):1.8 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:BALL
端子节距:1 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:30宽度:15 mm
Base Number Matches:1

CY7C2665KV18-450BZI 数据手册

 浏览型号CY7C2665KV18-450BZI的Datasheet PDF文件第2页浏览型号CY7C2665KV18-450BZI的Datasheet PDF文件第3页浏览型号CY7C2665KV18-450BZI的Datasheet PDF文件第4页浏览型号CY7C2665KV18-450BZI的Datasheet PDF文件第5页浏览型号CY7C2665KV18-450BZI的Datasheet PDF文件第6页浏览型号CY7C2665KV18-450BZI的Datasheet PDF文件第7页 
CY7C2663KV18/CY7C2665KV18  
144-Mbit QDR® II+ SRAM Four-Word  
Burst Architecture (2.5 Cycle Read Latency) with ODT  
144-Mbit QDR® II+ SRAM Four-Word Burst Architecture (2.5 Cycle Read Latency) with ODT  
Features  
Configurations  
Separate independent read and write data ports  
Supports concurrent transactions  
With Read Cycle Latency of 2.5 cycles:  
CY7C2663KV18: 8M × 18  
550-MHz clock for high bandwidth  
CY7C2665KV18: 4M × 36  
Four-word burst for reducing address bus frequency  
Functional Description  
Double data rate (DDR) interfaces on both read and write ports  
(data transferred at 1100 MHz) at 550 MHz  
The CY7C2663KV18, and CY7C2665KV18 are 1.8 V  
synchronous pipelined SRAMs, equipped with QDR II+  
architecture. Similar to QDR II architecture, QDR II+ architecture  
consists of two separate ports: the read port and the write port to  
access the memory array. The read port has dedicated data  
outputs to support read operations and the write port has  
dedicated data inputs to support write operations. QDR II+  
architecture has separate data inputs and data outputs to  
completely eliminate the need to “turnaround” the data bus that  
exists with common I/O devices. Each port is accessed through  
a common address bus. Addresses for read and write addresses  
are latched on alternate rising edges of the input (K) clock.  
Accesses to the QDR II+ read and write ports are completely  
independent of one another. To maximize data throughput, both  
read and write ports are equipped with DDR interfaces. Each  
address location is associated with four 18-bit words  
(CY7C2663KV18), or 36-bit words (CY7C2665KV18) that burst  
sequentially into or out of the device. Because data is transferred  
into and out of the device on every rising edge of both input  
clocks (K and K), memory bandwidth is maximized while  
simplifying system design by eliminating bus “turn arounds”.  
Available in 2.5-clock cycle latency  
Two input clocks (K and K) for precise DDR timing  
Static random access memory (SRAM) uses rising edges  
only  
Echo clocks (CQ and CQ) simplify data capture in high-speed  
systems  
Data valid pin (QVLD) to indicate valid data on the output  
On-die termination (ODT) feature  
Supported for D[x:0], BWS[x:0], and K/K inputs  
Single multiplexed address input bus latches address inputs  
for read and write ports  
Separate port selects for depth expansion  
Synchronous internally self-timed writes  
Quad data rate (QDR®) II+ operates with 2.5-cycle read latency  
when DOFF is asserted high  
OperatessimilartoQDRIdevicewith1cyclereadlatencywhen  
DOFF is asserted low  
These devices have an ODT feature supported for D[x:0]  
,
BWS[x:0], and K/K inputs, which helps eliminate external  
termination resistors, reduce cost, reduce board area, and  
simplify board routing.  
Available in × 18, and × 36 configurations  
Full data coherency, providing most current data  
[1]  
Core VDD = 1.8 V ± 0.1 V; I/O VDDQ = 1.4 V to VDD  
Supports both 1.5 V and 1.8 V I/O supply  
Depth expansion is accomplished with port selects, which  
enables each port to operate independently.  
All synchronous inputs pass through input registers controlled by  
the K or K input clocks. All data outputs pass through output  
registers controlled by the K or K input clocks. Writes are  
conducted with on-chip synchronous self-timed write circuitry.  
High-speed transceiver logic (HSTL) inputs and variable drive  
HSTL output buffers  
Available in 165-ball fine-pitch ball grid array (FBGA) package  
(15 ×17 ×1.4 mm)  
For a complete list of related documentation, click here.  
Offered in both Pb-free and non Pb-free packages  
JTAG 1149.1 compatible test access port  
Phase locked loop (PLL) for accurate data placement  
Selection Guide  
Description  
Maximum operating frequency  
Maximum operating current  
550 MHz  
550  
1090  
450 MHz Unit  
450  
940  
MHz  
mA  
× 18  
× 36  
1520  
1290  
Note  
1. The Cypress QDR II+ devices surpass the QDR consortium specification and can support V  
= 1.4 V to V  
.
DD  
DDQ  
Cypress Semiconductor Corporation  
Document Number: 001-44141 Rev. *Q  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised November 24, 2017  
 
 
 
 
 

CY7C2665KV18-450BZI 替代型号

型号 品牌 替代类型 描述 数据表
CY7C1645KV18-450BZXI CYPRESS

完全替代

144-Mbit QDR® II SRAM Four-Word Burst Archit

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