CY7C1392KV18, CY7C1992KV18
CY7C1393KV18, CY7C1394KV18
18-Mbit DDR II SIO SRAM
Two-Word Burst Architecture
Features
Functional Description
■ 18 Mbit density (2 M x 8, 2 M x 9, 1 M x 18, 512 K x 36)
■ 333-MHz clock for high bandwidth
The CY7C1392KV18, CY7C1992KV18, CY7C1393KV18, and
CY7C1394KV18 are 1.8 V Synchronous Pipelined SRAMs,
equipped with DDR II SIO (double data rate separate I/O)
architecture. The DDR II SIO consists of two separate ports: the
read port and the write port to access the memory array. The
read port has data outputs to support read operations and the
write port has data inputs to support write operations. The DDR II
SIO has separate data inputs and data outputs to completely
eliminate the need to ‘turnaround’ the data bus required with
common I/O devices. Access to each port is accomplished
through a common address bus. Addresses for read and write
are latched on alternate rising edges of the input (K) clock. Write
data is registered on the rising edges of both K and K. Read data
is driven on the rising edges of C and C if provided, or on the
rising edge of K and K if C/C are not provided. Each address
location is associated with two 8-bit words in the case of
CY7C1392KV18, two 9-bit words in the case of
■ Two-word burst for reducing address bus frequency
■ Double data rate (DDR) interfaces
(data transferred at 666 MHz) at 333 MHz
■ Two input clocks (K and K) for precise DDR timing
❐ SRAM uses rising edges only
■ Two input clocks for output data (C and C) to minimize clock
skew and flight time mismatches
■ Echo clocks (CQ and CQ) simplify data capture in high-speed
systems
■ Synchronous internally self timed writes
■ DDR II operates with 1.5 cycle read latency when DOFF is
asserted HIGH
CY7C1992KV18, two 18-bit words in the case of
CY7C1393KV18, and two 36-bit words in the case of
CY7C1394KV18 that burst sequentially into or out of the device.
■ Operates similar to DDR I device with one cycle read latency
Asynchronous inputs include an output impedance matching
input (ZQ). Synchronous data outputs are tightly matched to the
two output echo clocks CQ/CQ, eliminating the need to capture
data separately from each individual DDR II SIO SRAM in the
system design. Output data clocks (C/C) enable maximum
system clocking and data synchronization flexibility.
when DOFF is asserted LOW
■ 1.8 V core power supply with HSTL inputs and outputs
■ Variable drive HSTL output buffers
■ Expanded HSTL output voltage (1.4 V–VDD
)
❐ Supports both 1.5 V and 1.8 V I/O supply
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the C or C (or K or K in a single clock
domain) input clocks. Writes are conducted with on-chip
synchronous self-timed write circuitry.
■ Available in 165-ball FBGA package (13 x 15 x 1.4 mm)
■ Offered in both Pb-free and non Pb-free packages
■ JTAG 1149.1 compatible test access port
■ Phase locked loop (PLL) for accurate data placement
Configurations
CY7C1392KV18 – 2 M x 8
CY7C1992KV18 – 2 M x 9
CY7C1393KV18 – 1 M x 18
CY7C1394KV18 – 512 K x 36
Table 1. Selection Guide
Description
Maximum operating frequency
Maximum operating current
333 MHz
333
300 MHz
300
250 MHz
250
200 MHz
200
167 MHz
167
Unit
MHz
mA
x8
x9
440
420
370
330
300
440
420
370
330
300
x18
x36
450
430
380
340
310
560
520
460
400
360
Cypress Semiconductor Corporation
Document Number: 001-58907 Rev. *B
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised February 25, 2011
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