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CY7C1992CV18-300BZI PDF预览

CY7C1992CV18-300BZI

更新时间: 2024-11-30 06:51:47
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赛普拉斯 - CYPRESS 静态存储器双倍数据速率
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30页 674K
描述
18-Mbit DDR-II SIO SRAM 2-Word Burst Architecture

CY7C1992CV18-300BZI 数据手册

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CY7C1392CV18, CY7C1992CV18  
CY7C1393CV18, CY7C1394CV18  
18-Mbit DDR-II SIO SRAM 2-Word  
Burst Architecture  
Features  
Functional Description  
18-Mbit density (2M x 8, 2M x 9, 1M x 18, 512K x 36)  
300 MHz clock for high bandwidth  
The CY7C1392CV18, CY7C1992CV18, CY7C1393CV18, and  
CY7C1394CV18 are 1.8V Synchronous Pipelined SRAMs,  
equipped with Double Data Rate Separate IO (DDR-II SIO)  
architecture. The DDR-II SIO consists of two separate ports: the  
read port and the write port to access the memory array. The  
read port has data outputs to support read operations and the  
write port has data inputs to support write operations. The DDR-II  
SIO has separate data inputs and data outputs to completely  
eliminate the need to “turn-around” the data bus required with  
common IO devices. Access to each port is accomplished  
through a common address bus. Addresses for read and write  
are latched on alternate rising edges of the input (K) clock. Write  
data is registered on the rising edges of both K and K. Read data  
is driven on the rising edges of C and C if provided, or on the  
rising edge of K and K if C/C are not provided. Each address  
location is associated with two 8-bit words in the case of  
CY7C1392CV18, two 9-bit words in the case of  
CY7C1992CV18, two 18-bit words in the case of  
CY7C1393CV18, and two 36-bit words in the case of  
CY7C1394CV18 that burst sequentially into or out of the device.  
2-word burst for reducing address bus frequency  
Double Data Rate (DDR) interfaces  
(data transferred at 600 MHz) at 300 MHz  
Two input clocks (K and K) for precise DDR timing  
SRAM uses rising edges only  
Two input clocks for output data (C and C) to minimize clock  
skew and flight time mismatches  
Echo clocks (CQ and CQ) simplify data capture in high-speed  
systems  
Synchronous internally self-timed writes  
DDR-II operates with 1.5 cycle read latency when the DLL is  
enabled  
Operates similar to a DDR-I device with 1 cycle read latency in  
DLL off mode  
1.8V core power supply with HSTL inputs and outputs  
Variable drive HSTL output buffers  
Asynchronous inputs include an output impedance matching  
input (ZQ). Synchronous data outputs are tightly matched to the  
two output echo clocks CQ/CQ, eliminating the need to capture  
data separately from each individual DDR-II SIO SRAM in the  
system design. Output data clocks (C/C) enable maximum  
system clocking and data synchronization flexibility.  
Expanded HSTL output voltage (1.4V–VDD  
)
Available in 165-Ball FBGA package (13 x 15 x 1.4 mm)  
Offered in both Pb-free and non Pb-free packages  
JTAG 1149.1 compatible test access port  
All synchronous inputs pass through input registers controlled by  
the K or K input clocks. All data outputs pass through output  
registers controlled by the C or C (or K or K in a single clock  
domain) input clocks. Writes are conducted with on-chip  
synchronous self-timed write circuitry.  
Delay Lock Loop (DLL) for accurate data placement  
Configurations  
CY7C1392CV18 – 2M x 8  
CY7C1992CV18 – 2M x 9  
CY7C1393CV18 – 1M x 18  
CY7C1394CV18 – 512K x 36  
Selection Guide  
Description  
300 MHz  
300  
278 MHz  
278  
250 MHz  
250  
200 MHz  
200  
167 MHz  
167  
Unit  
MHz  
mA  
Maximum Operating Frequency  
Maximum Operating Current  
x8  
x9  
820  
770  
700  
575  
485  
825  
775  
700  
575  
490  
x18  
x36  
865  
800  
725  
600  
500  
935  
850  
770  
630  
540  
Cypress Semiconductor Corporation  
Document #: 001-07162 Rev. *C  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised May 22, 2008  
[+] Feedback  

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