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CY7C1623KV18-333BZXC PDF预览

CY7C1623KV18-333BZXC

更新时间: 2024-02-16 16:11:29
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器双倍数据速率
页数 文件大小 规格书
28页 773K
描述
144-Mbit DDR-II SIO SRAM Two-Word Burst Architecture

CY7C1623KV18-333BZXC 数据手册

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CY7C1623KV18  
144-Mbit DDR-II SIO SRAM Two-Word  
Burst Architecture  
144-Mbit DDR-II SIO SRAM Two-Word Burst Architecture  
Features  
Configuration  
144-Mbit density (8 M × 18)  
CY7C1623KV18 – 8 M × 18  
333 MHz clock for high bandwidth  
Functional Description  
The CY7C1623KV18 is 1.8 V Synchronous Pipelined SRAM,  
Two-word burst for reducing address bus frequency  
Double Data Rate (DDR) interfaces (data transferred at  
666 MHz) at 333 MHz  
equipped with DDR-II SIO (Double Data Rate Separate I/O)  
architecture. The DDR-II SIO consists of two separate ports: the  
read port and the write port to access the memory array. The  
read port has data outputs to support read operations and the  
write port has data inputs to support write operations. The DDR-II  
SIO has separate data inputs and data outputs to completely  
eliminate the need to ‘turnaround’ the data bus required with  
common I/O devices. Access to each port is accomplished  
through a common address bus. Addresses for read and write  
are latched on alternate rising edges of the input (K) clock. Write  
data is registered on the rising edges of both K and K. Read data  
is driven on the rising edges of C and C if provided, or on the  
rising edge of K and K if C/C are not provided. Each address  
location is associated with two 18-bit words that burst  
sequentially into or out of the device.  
Two input clocks (K and K) for precise DDR timing  
SRAM uses rising edges only  
Two input clocks for output data (C and C) to minimize clock  
skew and flight time mismatches  
Echo clocks (CQ and CQ) simplify data capture in high speed  
systems  
Synchronous internally self timed writes  
DDR-II operates with 1.5 cycle read latency when DOFF is  
asserted HIGH  
Operates similar to DDR-I device with 1 cycle read latency  
Asynchronous inputs include an output impedance matching  
input (ZQ). Synchronous data outputs are tightly matched to the  
two output echo clocks CQ/CQ, eliminating the need to capture  
data separately from each individual DDR-II SIO SRAM in the  
system design. Output data clocks (C/C) enable maximum  
system clocking and data synchronization flexibility.  
when DOFF is asserted LOW  
1.8 V core power supply with HSTL inputs and outputs  
Variable drive HSTL output buffers  
Expanded HSTL output voltage (1.4 V–VDD  
)
Supports both 1.5 V and 1.8 V I/O supply  
All synchronous inputs pass through input registers controlled by  
the K or K input clocks. All data outputs pass through output  
registers controlled by the C or C (or K or K in a single clock  
domain) input clocks. Writes are conducted with on-chip  
synchronous self-timed write circuitry.  
Available in 165-ball FBGA package (15 × 17 × 1.4 mm)  
Offered in Pb-free package  
JTAG 1149.1 compatible test access port  
Phase Locked Loop (PLL) for accurate data placement  
Selection Guide  
Description  
Maximum Operating Frequency  
333 MHz  
333  
250 MHz Unit  
250  
560  
MHz  
mA  
Maximum Operating Current  
× 18  
650  
Cypress Semiconductor Corporation  
Document Number: 001-44276 Rev. *G  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised March 28, 2013  

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