生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | 15 X 17 MM, 1.40 MM HEIGHT, FBGA-165 | 针数: | 165 |
Reach Compliance Code: | unknown | ECCN代码: | 3A991.B.2.A |
HTS代码: | 8542.32.00.41 | 风险等级: | 5.8 |
其他特性: | PIPELINED ARCHITECTURE | JESD-30 代码: | R-PBGA-B165 |
内存密度: | 150994944 bit | 内存集成电路类型: | QDR SRAM |
内存宽度: | 9 | 功能数量: | 1 |
端子数量: | 165 | 字数: | 16777216 words |
字数代码: | 16000000 | 工作模式: | SYNCHRONOUS |
最高工作温度: | 70 °C | 最低工作温度: | |
组织: | 16MX9 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | BGA | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY | 并行/串行: | PARALLEL |
认证状态: | Not Qualified | 最大供电电压 (Vsup): | 1.9 V |
最小供电电压 (Vsup): | 1.7 V | 标称供电电压 (Vsup): | 1.8 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子形式: | BALL |
端子位置: | BOTTOM |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
CY7C1625KV18-200BZXC | CYPRESS |
获取价格 |
QDR SRAM, 16MX9, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-165 |
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CY7C1625KV18-250BZXC | INFINEON |
获取价格 |
Synchronous SRAM |
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CY7C1625KV18-250BZXI | CYPRESS |
获取价格 |
QDR SRAM, 16MX9, 0.45ns, CMOS, PBGA165, FBGA-165 |
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CY7C1625KV18-250BZXI | INFINEON |
获取价格 |
Synchronous SRAM |
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CY7C1625KV18-300BZI | CYPRESS |
获取价格 |
QDR SRAM, 16MX9, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, FBGA-165 |
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CY7C1625KV18-333BZC | CYPRESS |
获取价格 |
QDR SRAM, 16MX9, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, FBGA-165 |
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CY7C1625KV18-333BZXC | INFINEON |
获取价格 |
Synchronous SRAM |
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CY7C162A-12DMB | CYPRESS |
获取价格 |
Standard SRAM, 16KX4, 12ns, CMOS, CDIP28, 0.300 INCH, CERDIP-28 |
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CY7C162A-12KMB | CYPRESS |
获取价格 |
Standard SRAM, 16KX4, 12ns, CMOS, CDFP28, CERPACK-28 |
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CY7C162A-12LMB | CYPRESS |
获取价格 |
Standard SRAM, 16KX4, 12ns, CMOS, CQCC28, CERAMIC, LCC-28 |
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