Datasheet > 存储 > SRAM> CY7C1372C-225AC

CY7C1372C-225AC

更新时间： 2024-11-07 21:56:31

品牌	Logo	应用领域
赛普拉斯 - CYPRESS		存储内存集成电路静态存储器时钟
页数	文件大小	规格书
27页	678K
描述
512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture

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技术参数
数据手册
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CY7C1372C-225AC 技术参数

是否Rohs认证：	不符合	生命周期：	Obsolete
零件包装代码：	QFP	包装说明：	14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
针数：	100	Reach Compliance Code：	not_compliant
ECCN代码：	3A991.B.2.A	HTS代码：	8542.32.00.41
风险等级：	5.3	最长访问时间：	2.8 ns
其他特性：	PIPELINED ARCHITECTURE	最大时钟频率 (fCLK)：	225 MHz
I/O 类型：	COMMON	JESD-30 代码：	R-PQFP-G100
JESD-609代码：	e0	长度：	20 mm
内存密度：	18874368 bit	内存集成电路类型：	ZBT SRAM
内存宽度：	18	湿度敏感等级：	3
功能数量：	1	端子数量：	100
字数：	1048576 words	字数代码：	1000000
工作模式：	SYNCHRONOUS	最高工作温度：	70 °C
最低工作温度：		组织：	1MX18
输出特性：	3-STATE	封装主体材料：	PLASTIC/EPOXY
封装代码：	LQFP	封装等效代码：	QFP100,.63X.87
封装形状：	RECTANGULAR	封装形式：	FLATPACK, LOW PROFILE
并行/串行：	PARALLEL	峰值回流温度（摄氏度）：	225
电源：	2.5/3.3,3.3 V	认证状态：	Not Qualified
座面最大高度：	1.6 mm	最大待机电流：	0.07 A
最小待机电流：	3.14 V	子类别：	SRAMs
最大压摆率：	0.325 mA	最大供电电压 (Vsup)：	3.63 V
最小供电电压 (Vsup)：	3.135 V	标称供电电压 (Vsup)：	3.3 V
表面贴装：	YES	技术：	CMOS
温度等级：	COMMERCIAL	端子面层：	Tin/Lead (Sn/Pb)
端子形式：	GULL WING	端子节距：	0.65 mm
端子位置：	QUAD	处于峰值回流温度下的最长时间：	30
宽度：	14 mm	Base Number Matches：	1

CY7C1372C-225AC 数据手册

CY7C1370C

CY7C1372C

512K x 36/1M x 18 Pipelined SRAM

with NoBL™ Architecture

Features

Functional Description

The CY7C1370C and CY7C1372C are 3.3V, 512K x 36 and

• Pin-compatible and functionally equivalent to ZBT™

• Supports 250-MHz bus operations with zero wait states

1M x 18 Synchronous pipelined burst SRAMs with No Bus

Latency™ (NoBL) logic, respectively. They are designed to

support unlimited true back-to-back Read/Write operations

with no wait states. The CY7C1370C and CY7C1372C are

equipped with the advanced (NoBL) logic required to enable

consecutive Read/Write operations with data being trans-

ferred on every clock cycle. This feature dramatically improves

the throughput of data in systems that require frequent

Write/Read transitions. The CY7C1370C and CY7C1372C are

pin compatible and functionally equivalent to ZBT devices.

— Available speed grades are 250, 225, 200 and

167 MHz

• Internally self-timed output buffer control to eliminate

the need to use asynchronous OE

• Fully registered (inputs and outputs) for pipelined

operation

• Byte Write capability

• Single 3.3V power supply

All synchronous inputs pass through input registers controlled

by the rising edge of the clock. All data outputs pass through

output registers controlled by the rising edge of the clock. The

clock input is qualified by the Clock Enable (CEN) signal,

which when deasserted suspends operation and extends the

previous clock cycle.

Write operations are controlled by the Byte Write Selects

(BW_a–BW_dfor CY7C1370C and BW_a–BW_bfor CY7C1372C)

and a Write Enable (WE) input. All writes are conducted with

on-chip synchronous self-timed write circuitry.

Three synchronous Chip Enables (CE₁, CE₂, CE₃) and an

asynchronous Output Enable (OE) provide for easy bank

selection and output three-state control. In order to avoid bus

contention, the output drivers are synchronously three-stated

during the data portion of a write sequence.

• 3.3V/2.5V I/O power supply

• Fast clock-to-output times

— 2.6 ns (for 250-MHz device)

— 2.8 ns (for 225-MHz device)

— 3.0 ns (for 200-MHz device)

— 3.4 ns (for 167-MHz device)

• Clock Enable (CEN) pin to suspend operation

• Synchronous self-timed writes

• Available in 100 TQFP, 119 BGA, and 165 fBGA

packages

• IEEE 1149.1 JTAG Boundary Scan

• Burst capability—linear or interleaved burst order

• “ZZ” Sleep Mode option and Stop Clock option

Logic Block Diagram-CY7C1370C (512K x 36)

ADDRESS

A0, A1, A

A1'

A0'

BURST

LOGIC

MODE

ADV/LD

CLK

CEN

WRITE ADDRESS

ADV/LD

WRITE REGISTRY

AND DATA COHERENCY

CONTROL LOGIC

MEMORY

ARRAY

DQs

DQP

WRITE

DRIVERS

INPUT

READ LOGIC

CE1

CE2

CE3

SLEEP

CONTROL

Cypress Semiconductor Corporation

•

3901 North First Street

•

San Jose, CA 95134

•

408-943-2600

Document #: 38-05233 Rev. *D

Revised June 03, 2004

12 3 4 5 6 7...27

中文翻译

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CY7C1372C-225AC 替代型号

型号	品牌	替代类型	描述	数据表
CY7C1372B-167AC	CYPRESS	功能相似	512K 】 36/1M 】 18 Pipelined SRAM with NoBL Ar
CY7C1372D-250AXI	CYPRESS	功能相似	18-Mbit (512K X 36/1M X 18) Pipelined SRAM with NoBL Architecture
CY7C1372D-250AXC	CYPRESS	功能相似	18-Mbit (512K X 36/1M X 18) Pipelined SRAM with NoBL Architecture

与CY7C1372C-225AC相关器件

型号	品牌	获取价格	描述	数据表
CY7C1372C-225AI	CYPRESS	获取价格	512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture
CY7C1372C-225BGC	CYPRESS	获取价格	512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture
CY7C1372C-225BGI	CYPRESS	获取价格	512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture
CY7C1372C-225BZC	CYPRESS	获取价格	512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture
CY7C1372C-225BZI	CYPRESS	获取价格	512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture
CY7C1372C-250AC	CYPRESS	获取价格	512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture
CY7C1372C-250AI	CYPRESS	获取价格	512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture
CY7C1372C-250BGC	CYPRESS	获取价格	512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture
CY7C1372C-250BGI	CYPRESS	获取价格	512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture
CY7C1372C-250BZC	CYPRESS	获取价格	512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture

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