CY7C1360C
CY7C1362C
PRELIMINARY
9-Mbit (256K x 36/512K x 18) Pipelined SRAM
Features
Functional Description[1]
• Supports bus operation up to 250 MHz
• Available speed grades are 250, 200, and 166 MHz
• Registered inputs and outputs for pipelined operation
• 3.3V core power supply
The CY7C1360C/CY7C1362C SRAM integrates 262,144 x 36
and 524,288 x 18 SRAM cells with advanced synchronous
peripheral circuitry and a two-bit counter for internal burst
operation. All synchronous inputs are gated by registers
controlled by a positive-edge-triggered Clock Input (CLK). The
synchronous inputs include all addresses, all data inputs,
address-pipelining Chip Enable (CE1), depth-expansion Chip
Enables (CE2 and CE3[2]), Burst Control inputs (ADSC, ADSP,
• 2.5V/3.3V I/O operation
• Fast clock-to-output times
ADV), Write Enables (BW , and BWE), and Global Write
(GW). Asynchronous inputs include the Output Enable (OE)
and the ZZ pin.
and
— 2.8 ns (for 250-MHz device)
X
— 3.0 ns (for 200-MHz device)
— 3.5 ns (for 166-MHz device)
Addresses and chip enables are registered at rising edge of
clock when either Address Strobe Processor (ADSP) or
Address Strobe Controller (ADSC) are active. Subsequent
burst addresses can be internally generated as controlled by
the Advance pin (ADV).
• Provide high-performance 3-1-1-1 access rate
• User-selectable burst counter supporting Intel®
Pentium® interleaved or linear burst sequences
• Separate processor and controller address strobes
• Synchronous self-timed writes
Address, data inputs, and write controls are registered on-chip
to initiate a self-timed Write cycle.This part supports Byte Write
operations (see Pin Descriptions and Truth Table for further
details). Write cycles can be one to two or four bytes wide as
controlled by the Byte Write control inputs. GW when active
• Asynchronous output enable
• Single Cycle Chip Deselect
• Offered in Lead-Free 100-pin TQFP, 119-ball BGA and
165-Ball fBGA packages
LOW cause
s all bytes to be written.
The CY7C1360C/CY7C1362C operates from a +3.3V core
power supply while all outputs may operate with either a +2.5
or +3.3V supply. All inputs and outputs are JEDEC-standard
JESD8-5-compatible.
• TQFP Available with 3-Chip Enable and 2-Chip Enable
• IEEE 1149.1 JTAG-Compatible Boundary Scan
• “ZZ” Sleep Mode Option
Logic Block Diagram – CY7C1360C (256K x 36)
A0, A1, A
ADDRESS
REGISTER
2
A[1:0]
MODE
Q1
ADV
CLK
BURST
COUNTER
AND
CLR
Q0
LOGIC
ADSC
ADSP
DQ
BYTE
WRITE REGISTER
D ,DQPD
DQ
BYTE
WRITE DRIVER
D ,DQPD
BW
D
DQC ,DQP
BYTE
WRITE DRIVER
C
DQC ,DQP
BYTE
WRITE REGISTER
C
BW
C
OUTPUT
BUFFERS
OUTPUT
MEMORY
DQ s
SENSE
AMPS
ARRAY
REGISTERS
DQP
DQP
DQP
A
DQB ,DQP
BYTE
WRITE DRIVER
B
E
DQB ,DQP
BYTE
WRITE REGISTER
B
B
C
BW
BW
B
A
DQPD
DQ
BYTE
WRITE DRIVER
A ,DQPA
DQ
A ,DQPA
BYTE
WRITE REGISTER
BWE
INPUT
REGISTERS
GW
ENABLE
REGISTER
PIPELINED
ENABLE
CE
CE
CE
1
2
3
OE
SLEEP
CONTROL
ZZ
Notes:
1. For best-practices recommendations, please refer to the Cypress application note System Design Guidelines on www.cypress.com.
2. CE is for A version of TQFP (3 Chip Enable option) and 165 fBGA package only. 119 BGA is offered only in 2 Chip Enable.
3
Cypress Semiconductor Corporation
Document #: 38-05540 Rev. *C
•
3901 North First Street
•
San Jose, CA 95134
•
408-943-2600
Revised February 23, 2005