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CY7C13201KV18-300BZXC PDF预览

CY7C13201KV18-300BZXC

更新时间: 2024-11-25 01:14:27
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 双倍数据速率静态存储器
页数 文件大小 规格书
23页 1138K
描述
18-Mbit DDR II SRAM 2-Word Burst Architecture

CY7C13201KV18-300BZXC 数据手册

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CY7C13201KV18  
18-Mbit DDR II SRAM 2-Word  
Burst Architecture  
Features  
Functional Description  
18 Mbit Density (512K x 36)  
The CY7C13201KV18 is 1.8V Synchronous Pipelined SRAM  
equipped with DDR II architecture. The DDR II consists of an  
SRAM core with advanced synchronous peripheral circuitry and  
a 1-bit burst counter. Addresses for read and write are latched  
on alternate rising edges of the input (K) clock. Write data is  
registered on the rising edges of both K and K. Read data is  
driven on the rising edges of C and C if provided, or on the rising  
edge of K and K if C/C are not provided. The burst counter takes  
in the least significant bit of the external address and bursts two  
two 36-bit words sequentially into or out of the device.  
333 MHz Clock for High Bandwidth  
2-Word Burst to Reduce Address Bus Frequency  
Double Data Rate (DDR) Interfaces  
(data transferred at 666 MHz) at 333 MHz  
Two Input Clocks (K and K) for Precise DDR Timing  
SRAM uses rising edges only  
Two Input Clocks for Output Data (C and C) to minimize Clock  
Skew and Flight Time Mismatches  
Asynchronous inputs include an output impedance matching  
input (ZQ). Synchronous data outputs (Q, sharing the same  
physical pins as the data inputs D) are tightly matched to the two  
output echo clocks CQ/CQ, eliminating the need for separately  
capturing data from each individual DDR SRAM in the system  
design. Output data clocks (C/C) enable maximum system  
clocking and data synchronization flexibility.  
Echo Clocks (CQ and CQ) simplify Data Capture in High Speed  
Systems  
Synchronous Internally Self Timed Writes  
DDR II Operates with 1.5 Cycle Read Latency when DOFF is  
All synchronous inputs pass through input registers controlled by  
the K or K input clocks. All data outputs pass through output  
registers controlled by the C or C (or K or K in a single clock  
domain) input clocks. Writes are conducted with on-chip  
synchronous self-timed write circuitry.  
Asserted HIGH  
Operates Similar to DDR I Device with 1 Cycle Read Latency  
when DOFF is Asserted LOW  
1.8V Core Power Supply with HSTL Inputs and Outputs  
Variable Drive HSTL Output Buffers  
This device is down bonded from the 65 nm 72M QDRII device  
and has the same IDD SB1 values and JTAG ID code as the  
/I  
equivalent 72M device option. For details refer to the application  
note AN53189, 65 nm Technology Interim QDRII/DDRII SRAM  
Device Family Description.  
Expanded HSTL Output Voltage (1.4V–VDD  
Supports both 1.5V and 1.8V I/O supply  
)
Available in 165-Ball FBGA Package (13 x 15 x 1.4 mm)  
Offered in both Pb-free and Non Pb-free Packages  
JTAG 1149.1 Compatible Test Access Port  
Phase Locked Loop (PLL) for Accurate Data Placement  
Configuration  
CY7C13201KV18 – 512K x 36  
Table 1. Selection Guide  
Description  
333 MHz  
333  
300 MHz  
300  
250 MHz  
250  
200 MHz  
200  
167 MHz  
167  
Unit  
MHz  
mA  
Maximum Operating Frequency  
Maximum Operating Current  
640  
600  
530  
450  
400  
Cypress Semiconductor Corporation  
Document Number: 001-54142 Rev. *B  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised September 11, 2009  
[+] Feedback  

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