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CY7C1315BV18-278BZXC PDF预览

CY7C1315BV18-278BZXC

更新时间: 2024-11-16 05:19:07
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赛普拉斯 - CYPRESS 静态存储器
页数 文件大小 规格书
28页 501K
描述
18-Mbit QDR⑩-II SRAM 4-Word Burst Architecture

CY7C1315BV18-278BZXC 数据手册

 浏览型号CY7C1315BV18-278BZXC的Datasheet PDF文件第2页浏览型号CY7C1315BV18-278BZXC的Datasheet PDF文件第3页浏览型号CY7C1315BV18-278BZXC的Datasheet PDF文件第4页浏览型号CY7C1315BV18-278BZXC的Datasheet PDF文件第5页浏览型号CY7C1315BV18-278BZXC的Datasheet PDF文件第6页浏览型号CY7C1315BV18-278BZXC的Datasheet PDF文件第7页 
CY7C1311BV18  
CY7C1911BV18  
CY7C1313BV18  
CY7C1315BV18  
18-Mbit QDR™-II SRAM 4-Word  
Burst Architecture  
Features  
Functional Description  
• Separate Independent Read and Write data ports  
— Supports concurrent transactions  
The CY7C1311BV18, CY7C1911BV18, CY7C1313BV18, and  
CY7C1315BV18 are 1.8V Synchronous Pipelined SRAMs,  
equipped with QDR™-II architecture. QDR-II architecture  
consists of two separate ports to access the memory array.  
The Read port has dedicated Data Outputs to support Read  
operations and the Write port has dedicated Data Inputs to  
support Write operations. QDR-II architecture has separate  
data inputs and data outputs to completely eliminate the need  
to “turn-around” the data bus required with common I/O  
devices. Access to each port is accomplished through a  
common address bus. Addresses for Read and Write  
addresses are latched on alternate rising edges of the input  
(K) clock. Accesses to the QDR-II Read and Write ports are  
completely independent of one another. In order to maximize  
data throughput, both Read and Write ports are equipped with  
Double Data Rate (DDR) interfaces. Each address location is  
associated with four 8-bit words (CY7C1311BV18) or 9-bit  
words (CY7C1911BV18) or 18-bit words (CY7C1313BV18) or  
36-bit words (CY7C1315BV18) that burst sequentially into or  
out of the device. Since data can be transferred into and out  
of the device on every rising edge of both input clocks (K and  
K and C and C), memory bandwidth is maximized while simpli-  
fying system design by eliminating bus “turn-arounds”.  
• 300-MHz clock for high bandwidth  
• 4-Word Burst for reducing address bus frequency  
• Double Data Rate (DDR) interfaces on both Read and  
Write ports (data transferred at 600 MHz) at 300 MHz  
• Two input clocks (K and K) for precise DDR timing  
— SRAM uses rising edges only  
• Two input clocks for output data (C and C) to minimize  
clock-skew and flight-time mismatches  
• Echo clocks (CQ and CQ) simplify data capture in  
high-speed systems  
• Single multiplexed address input bus latches address  
inputs for both Read and Write ports  
• Separate Port Selects for depth expansion  
• Synchronous internally self-timed writes  
• Available in x 8, x 9, x 18, and x 36 configurations  
• Full data coherency providing most current data  
• Core VDD = 1.8 (±0.1V); I/O VDDQ = 1.4V to VDD  
• Available in 165-ballFBGA package (13 x 15 x 1.4 mm)  
• Offered in both lead-free and non-lead free packages  
Depth expansion is accomplished with Port Selects for each  
port. Port selects allow each port to operate independently.  
• Variable drive HSTL output buffers  
All synchronous inputs pass through input registers controlled  
by the K or K input clocks. All data outputs pass through output  
registers controlled by the C or C (or K or K in a single clock  
domain) input clocks. Writes are conducted with on-chip  
synchronous self-timed write circuitry.  
• JTAG 1149.1 compatible test access port  
• Delay Lock Loop (DLL) for accurate data placement  
Configurations  
CY7C1311BV18 – 2M x 8  
CY7C1911BV18 – 2M x 9  
CY7C1313BV18 – 1M x 18  
CY7C1315BV18 – 512K x 36  
Selection Guide  
300 MHz  
300  
278 MHz  
250 MHz  
250  
200 MHz  
200  
167 MHz  
167  
Unit  
MHz  
mA  
Maximum Operating Frequency  
Maximum Operating Current  
278  
530  
550  
500  
450  
400  
Cypress Semiconductor Corporation  
Document Number: 38-05620 Rev. *C  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised June 27, 2006  
[+] Feedback  

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