CY7C1311BV18
CY7C1911BV18
CY7C1313BV18
CY7C1315BV18
18-Mbit QDR™-II SRAM 4-Word
Burst Architecture
Features
Functional Description
• Separate Independent Read and Write data ports
— Supports concurrent transactions
The CY7C1311BV18, CY7C1911BV18, CY7C1313BV18, and
CY7C1315BV18 are 1.8V Synchronous Pipelined SRAMs,
equipped with QDR™-II architecture. QDR-II architecture
consists of two separate ports to access the memory array.
The Read port has dedicated Data Outputs to support Read
operations and the Write port has dedicated Data Inputs to
support Write operations. QDR-II architecture has separate
data inputs and data outputs to completely eliminate the need
to “turn-around” the data bus required with common I/O
devices. Access to each port is accomplished through a
common address bus. Addresses for Read and Write
addresses are latched on alternate rising edges of the input
(K) clock. Accesses to the QDR-II Read and Write ports are
completely independent of one another. In order to maximize
data throughput, both Read and Write ports are equipped with
Double Data Rate (DDR) interfaces. Each address location is
associated with four 8-bit words (CY7C1311BV18) or 9-bit
words (CY7C1911BV18) or 18-bit words (CY7C1313BV18) or
36-bit words (CY7C1315BV18) that burst sequentially into or
out of the device. Since data can be transferred into and out
of the device on every rising edge of both input clocks (K and
K and C and C), memory bandwidth is maximized while simpli-
fying system design by eliminating bus “turn-arounds”.
• 300-MHz clock for high bandwidth
• 4-Word Burst for reducing address bus frequency
• Double Data Rate (DDR) interfaces on both Read and
Write ports (data transferred at 600 MHz) at 300 MHz
• Two input clocks (K and K) for precise DDR timing
— SRAM uses rising edges only
• Two input clocks for output data (C and C) to minimize
clock-skew and flight-time mismatches
• Echo clocks (CQ and CQ) simplify data capture in
high-speed systems
• Single multiplexed address input bus latches address
inputs for both Read and Write ports
• Separate Port Selects for depth expansion
• Synchronous internally self-timed writes
• Available in x 8, x 9, x 18, and x 36 configurations
• Full data coherency providing most current data
• Core VDD = 1.8 (±0.1V); I/O VDDQ = 1.4V to VDD
• Available in 165-ballFBGA package (13 x 15 x 1.4 mm)
• Offered in both lead-free and non-lead free packages
Depth expansion is accomplished with Port Selects for each
port. Port selects allow each port to operate independently.
• Variable drive HSTL output buffers
All synchronous inputs pass through input registers controlled
by the K or K input clocks. All data outputs pass through output
registers controlled by the C or C (or K or K in a single clock
domain) input clocks. Writes are conducted with on-chip
synchronous self-timed write circuitry.
• JTAG 1149.1 compatible test access port
• Delay Lock Loop (DLL) for accurate data placement
Configurations
CY7C1311BV18 – 2M x 8
CY7C1911BV18 – 2M x 9
CY7C1313BV18 – 1M x 18
CY7C1315BV18 – 512K x 36
Selection Guide
300 MHz
300
278 MHz
250 MHz
250
200 MHz
200
167 MHz
167
Unit
MHz
mA
Maximum Operating Frequency
Maximum Operating Current
278
530
550
500
450
400
Cypress Semiconductor Corporation
Document Number: 38-05620 Rev. *C
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised June 27, 2006
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