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CY7C1315CV18-167BZI PDF预览

CY7C1315CV18-167BZI

更新时间: 2024-11-16 05:19:07
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赛普拉斯 - CYPRESS 静态存储器
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31页 695K
描述
18-Mbit QDR⑩-II SRAM 4-Word Burst Architecture

CY7C1315CV18-167BZI 数据手册

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CY7C1311CV18, CY7C1911CV18  
CY7C1313CV18, CY7C1315CV18  
18-Mbit QDR™-II SRAM 4-Word  
Burst Architecture  
Features  
Configurations  
Separate independent read and write data ports  
Supports concurrent transactions  
CY7C1311CV18 – 2M x 8  
CY7C1911CV18 – 2M x 9  
CY7C1313CV18 – 1M x 18  
CY7C1315CV18 – 512K x 36  
300 MHz clock for high bandwidth  
4-word burst for reducing address bus frequency  
Functional Description  
DoubleDataRate(DDR)interfacesonbothreadandwriteports  
(data transferred at 600 MHz) at 300 MHz  
The CY7C1311CV18, CY7C1911CV18, CY7C1313CV18, and  
CY7C1315CV18 are 1.8V Synchronous Pipelined SRAMs,  
equipped with QDR™-II architecture. QDR-II architecture  
consists of two separate ports: the read port and the write port to  
access the memory array. The read port has dedicated data  
outputs to support read operations and the write port has  
dedicated data inputs to support write operations. QDR-II  
architecture has separate data inputs and data outputs to  
completely eliminate the need to “turn-around” the data bus  
required with common IO devices. Access to each port is  
accomplished through a common address bus. Addresses for  
read and write addresses are latched on alternate rising edges  
of the input (K) clock. Accesses to the QDR-II read and write  
ports are completely independent of one another. In order to  
maximize data throughput, both read and write ports are  
provided with DDR interfaces. Each address location is  
associated with four 8-bit words (CY7C1311CV18) or 9-bit words  
(CY7C1911CV18) or 18-bit words (CY7C1313CV18) or 36-bit  
words (CY7C1315CV18) that burst sequentially into or out of the  
device. Because data can be transferred into and out of the  
device on every rising edge of both input clocks (K and K and C  
and C), memory bandwidth is maximized while simplifying  
system design by eliminating bus “turn-arounds”.  
Two input clocks (K and K) for precise DDR timing  
SRAM uses rising edges only  
Two input clocks for output data (C and C) to minimize clock  
skew and flight time mismatches  
Echo clocks (CQ and CQ) simplify data capture in high-speed  
systems  
Single multiplexed address input bus latches address inputs  
for both read and write ports  
Separate port selects for depth expansion  
Synchronous internally self-timed writes  
QDR™-II operates with 1.5 cycle read latency when the Delay  
Lock Loop (DLL) is enabled  
Operates as a QDR-I device with 1 cycle read latency in DLL  
off mode  
Available in x 8, x 9, x 18, and x 36 configurations  
Full data coherency, providing most current data  
Core VDD = 1.8 (±0.1V); IO VDDQ = 1.4V to VDD  
Available in 165-Ball FBGA package (13 x 15 x 1.4 mm)  
Offered in both Pb-free and non Pb-free packages  
Variable drive HSTL output buffers  
Depth expansion is accomplished with port selects, which  
enables each port to operate independently.  
All synchronous inputs pass through input registers controlled by  
the K or K input clocks. All data outputs pass through output  
registers controlled by the C or C (or K or K in a single clock  
domain) input clocks. Writes are conducted with on-chip  
synchronous self-timed write circuitry.  
JTAG 1149.1 compatible test access port  
Delay Lock Loop (DLL) for accurate data placement  
Selection Guide  
300 MHz  
300  
278 MHz  
250 MHz  
250  
200 MHz  
200  
167 MHz  
167  
Unit  
MHz  
mA  
Maximum Operating Frequency  
Maximum Operating Current  
278  
720  
730  
760  
910  
x8  
x9  
765  
665  
560  
495  
800  
675  
570  
490  
x18  
x36  
840  
705  
590  
505  
985  
830  
675  
570  
Cypress Semiconductor Corporation  
Document Number: 001-07165 Rev. *C  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised September 26, 2007  
[+] Feedback  

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