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CY7C1270KV18-400BZXC PDF预览

CY7C1270KV18-400BZXC

更新时间: 2024-01-11 00:56:24
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赛普拉斯 - CYPRESS 静态存储器双倍数据速率
页数 文件大小 规格书
28页 898K
描述
36-Mbit DDR II+ SRAM 2-Word Burst Architecture (2.0 Cycle Read Latency)

CY7C1270KV18-400BZXC 数据手册

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CY7C1266KV18, CY7C1277KV18  
CY7C1268KV18, CY7C1270KV18  
36-Mbit DDR II+ SRAM 2-Word Burst  
Architecture (2.5 Cycle Read Latency)  
36-Mbit DDR II+ SRAM 2-Word Burst Architecture (2.5 Cycle Read Latency)  
Features  
Configurations  
36 Mbit density (4 M × 8, 4 M × 9, 2 M × 18, 1 M × 36)  
550 MHz clock for high bandwidth  
With Read Cycle Latency of 2.5 Cycles:  
CY7C1266KV18 – 4 M × 8  
CY7C1277KV18 – 4 M × 9  
2-word burst for reducing address bus frequency  
CY7C1268KV18 – 2 M × 18  
CY7C1270KV18 – 1 M × 36  
Double data rate (DDR) interfaces  
(data transferred at 1100 MHz) at 550 MHz  
Available in 2.5 clock cycle latency  
Functional Description  
Two input clocks (K and K) for precise DDR timing  
SRAM uses rising edges only  
The CY7C1266KV18, CY7C1277KV18, CY7C1268KV18, and  
CY7C1270KV18 are 1.8 V synchronous pipelined SRAMs  
equipped with DDR II+ architecture. The DDR II+ consists of an  
SRAM core with advanced synchronous peripheral circuitry.  
Addresses for read and write are latched on alternate rising  
edges of the input (K) clock. Write data is registered on the rising  
edges of both K and K. Read data is driven on the rising edges  
of K and K. Each address location is associated with two 8-bit  
words (CY7C1266KV18), 9-bit words (CY7C1277KV18), 18-bit  
words (CY7C1268KV18), or 36-bit words (CY7C1270KV18) that  
burst sequentially into or out of the device.  
Echo clocks (CQ and CQ) simplify data capture in high speed  
systems  
Data valid pin (QVLD) to indicate valid data on the output  
Synchronous internally self-timed writes  
DDR II+ operates with 2.5 cycle read latency when DOFF is  
asserted HIGH  
Operatessimilarto DDR Idevice with 1 cycle read latencywhen  
Asynchronous inputs include an output impedance matching  
input (ZQ). Synchronous data outputs (Q, sharing the same  
physical pins as the data inputs D) are tightly matched to the two  
output echo clocks CQ/CQ, eliminating the need for separately  
capturing data from each individual DDR SRAM in the system  
design.  
DOFF is asserted LOW  
[1]  
Core VDD = 1.8 V ± 0.1 V; I/O VDDQ = 1.4 V to VDD  
Supports both 1.5 V and 1.8 V I/O supply  
HSTL inputs and variable drive HSTL output buffers  
Available in 165-ball FBGA package (13 × 15 × 1.4 mm)  
Offered in both Pb-free and non Pb-free packages  
JTAG 1149.1 compatible test access port  
All synchronous inputs pass through input registers controlled by  
the K or K input clocks. All data outputs pass through output  
registers controlled by the K or K input clocks. Writes are  
conducted with on-chip synchronous self-timed write circuitry.  
Phase-locked loop (PLL) for accurate data placement  
Table 1. Selection Guide  
Description  
Maximum operating frequency  
550 MHz  
500 MHz  
500  
450 MHz  
450  
400 MHz  
400  
Unit  
MHz  
mA  
550  
690  
690  
700  
890  
Maximum operating current  
× 8  
× 9  
640  
590  
540  
640  
590  
540  
× 18  
× 36  
650  
600  
550  
830  
760  
690  
Note  
1. The Cypress QDR II+ devices surpass the QDR consortium specification and can support V  
= 1.4 V to V  
.
DD  
DDQ  
Cypress Semiconductor Corporation  
Document Number: 001-57835 Rev. *C  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised February 24, 2011  
[+] Feedback  

CY7C1270KV18-400BZXC 替代型号

型号 品牌 替代类型 描述 数据表
CY7C1270KV18-400BZC CYPRESS

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