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CY7C1062DV33-10BGXI PDF预览

CY7C1062DV33-10BGXI

更新时间: 2024-11-06 05:09:31
品牌 Logo 应用领域
赛普拉斯 - CYPRESS /
页数 文件大小 规格书
10页 316K
描述
16-Mbit (512K X 32) Static RAM

CY7C1062DV33-10BGXI 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:BGA
包装说明:BGA, BGA119,7X17,50针数:119
Reach Compliance Code:compliantECCN代码:3A991.B.2.B
HTS代码:8542.32.00.41风险等级:5.78
最长访问时间:10 nsI/O 类型:COMMON
JESD-30 代码:R-PBGA-B119JESD-609代码:e1
长度:22 mm内存密度:16777216 bit
内存集成电路类型:STANDARD SRAM内存宽度:32
湿度敏感等级:3功能数量:1
端口数量:1端子数量:119
字数:524288 words字数代码:512000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:512KX32
输出特性:3-STATE可输出:YES
封装主体材料:PLASTIC/EPOXY封装代码:BGA
封装等效代码:BGA119,7X17,50封装形状:RECTANGULAR
封装形式:GRID ARRAY并行/串行:PARALLEL
峰值回流温度(摄氏度):260认证状态:Not Qualified
座面最大高度:2.4 mm最大待机电流:0.025 A
最大压摆率:0.175 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:BALL端子节距:1.27 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:20
宽度:14 mmBase Number Matches:1

CY7C1062DV33-10BGXI 数据手册

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CY7C1062DV33  
PRELIMINARY  
16-Mbit (512K X 32) Static RAM  
Features  
Functional Description  
• High speed  
The CY7C1062DV33 is a high-performance CMOS Static  
RAM organized as 524,288 words by 32 bits.  
— tAA = 10 ns  
Writing to the device is accomplished by enabling the chip  
(CE1, CE2 and CE3 LOW) and forcing the Write Enable (WE)  
input LOW. If Byte Enable A (BA) is LOW, then data from I/O  
pins (I/O0 through I/O7), is written into the location specified on  
the address pins (A0 through A18). If Byte Enable B (BB) is  
LOW, then data from I/O pins (I/O8 through I/O15) is written into  
the location specified on the address pins (A0 through A18).  
Likewise, BC and BD correspond with the I/O pins I/O16 to I/O23  
and I/O24 to I/O31, respectively.  
• Low active power  
— ICC = 150 mA @ 10 ns  
• Low CMOS standby power  
— ISB2 = 25 mA  
• Operating voltages of 3.3 ± 0.3V  
• 2.0V data retention  
• Automatic power-down when deselected  
• TTL-compatible inputs and outputs  
Reading from the device is accomplished by enabling the chip  
(CE1, CE2, and CE3 LOW) while forcing the Output Enable  
(OE) LOW and Write Enable (WE) HIGH. If the first Byte  
Enable (BA) is LOW, then data from the memory location  
specified by the address pins will appear on I/O0 to I/O7. If Byte  
Enable B (BB) is LOW, then data from memory will appear on  
I/O8 to I/O15. Similarly, Bc and BD correspond to the third and  
fourth bytes. See the truth table at the back of this data sheet  
for a complete description of read and write modes.  
• Easy memory expansion with CE1, CE2, and CE3  
features  
• Available in Pb-free 119-ball plastic ball grid array  
(PBGA) package  
The input/output pins (I/O0 through I/O31) are placed in a  
high-impedance state when the device is deselected (CE1,  
CE2or CE3 HIGH), the outputs are disabled (OE HIGH), the  
byte selects are disabled (BA-D HIGH), or during a write  
operation (CE1, CE2, and CE3 LOW, and WE LOW).  
The CY7C1062DV33 is available in 119-ball plastic ball grid  
array (PBGA) package.  
WE  
CE1  
CE2  
Logic Block Diagram  
CE3  
INPUT BUFFERS  
OE  
BA  
BB  
BC  
A
A
A
A
A
0
1
2
3
4
BD  
512K x 32  
ARRAY  
I/O0–I/O31  
A
A
5
6
A
A
A
7
8
9
COLUMN  
DECODER  
Cypress Semiconductor Corporation  
Document #: 38-05477 Rev.*C  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised September 4, 2006  
[+] Feedback  

CY7C1062DV33-10BGXI 替代型号

型号 品牌 替代类型 描述 数据表
CY7C1062DV33-10BGXIT CYPRESS

完全替代

Standard SRAM, 512KX32, 10ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, LEAD FREE, PLASTI
CY7C1062DV33-10BGIT CYPRESS

完全替代

Standard SRAM, 512KX32, 10ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119
CY7C1062DV33-10BGI CYPRESS

完全替代

16-Mbit (512 K x 32) Static RAM

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