CY62157E MoBL®
8-Mbit (512 K × 16) Static RAM
8-Mbit (512
K × 16) Static RAM
addresses are not toggling. Place the device into standby mode
when deselected (CE1 HIGH or CE2 LOW or both BHE and BLE
are HIGH). The input or output pins (I/O0 through I/O15) are
placed in a high impedance state when:
Features
■ Very high speed: 45 ns
❐ Industrial: –40 °C to +85 °C
❐ Automotive-E: –40 °C to +125 °C
■ Deselected (CE1HIGH or CE2 LOW)
■ Outputs are disabled (OE HIGH)
■ Wide voltage range: 4.5 V–5.5 V
■ Ultra low standby power
■ Both Byte High Enable and Byte Low Enable are disabled
❐ Typical standby current: 2 A
❐ Maximum standby current: 8 A (Industrial)
(BHE, BLE HIGH)
■ Write operation is active (CE1 LOW, CE2 HIGH and WE LOW)
■ Ultra low active power
❐ Typical active current: 1.8 mA at f = 1 MHz
To write to the device, take Chip Enable (CE1 LOW and CE2
HIGH) and Write Enable (WE) inputs LOW. If Byte Low Enable
(BLE) is LOW, then data from I/O pins (I/O0 through I/O7), is
written into the location specified on the address pins (A0 through
18). If Byte High Enable (BHE) is LOW, then data from I/O pins
(I/O8 through I/O15) is written into the location specified on the
address pins (A0 through A18).
■ Ultra low standby power
■ Easy memory expansion with CE1, CE2 and OE features
■ Automatic power down when deselected
■ CMOS for optimum speed and power
A
To read from the device, take Chip Enable (CE1 LOW and CE2
HIGH) and Output Enable (OE) LOW while forcing the Write
Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then data
from the memory location specified by the address pins appear
on I/O0 to I/O7. If Byte High Enable (BHE) is LOW, then data from
memory appears on I/O8 to I/O15. See Truth Table on page 12
for a complete description of read and write modes.
■ Available in Pb-free 44-pin TSOP II and 48-ball VFBGA
package
Functional Description
The CY62157E is a high performance CMOS static RAM
organized as 512K words by 16 bits. This device features
advanced circuit design to provide ultra low active current. This
is ideal for providing More Battery Life (MoBL®) in portable
applications. The device also has an automatic power down
feature that significantly reduces power consumption when
The CY62157E device is suitable for interfacing with processors
that have TTL I/P levels. It is not suitable for processors that
require CMOS I/P levels. Please see Electrical Characteristics
on page 4 for more details and suggested alternatives.
Logic Block Diagram
DATA IN DRIVERS
A
10
A
A
9
8
7
A
A
A
A
A
6
5
4
3
512K x 16
RAM Array
I/O –I/O
0
7
I/O –I/O
8
15
A
A
A
2
1
0
COLUMN DECODER
CE2
CE1
BHE
WE
PowerDown
Circuit
CE2
CE1
BHE
BLE
OE
BLE
Cypress Semiconductor Corporation
Document Number: 38-05695 Rev. *I
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised June 5, 2013