CY62137VN MoBL®
2-Mbit (128K x 16) Static RAM
portable applications such as cellular telephones. The device
also has an automatic power-down feature that reduces power
consumption by 99% when addresses are not toggling. The
device can also be put into standby mode when deselected
(CE HIGH) or when CE is LOW and both BLE and BHE are
HIGH. The input/output pins (I/O0 through I/O15) are placed in
a high-impedance state when: deselected (CE HIGH), outputs
are disabled (OE HIGH), BHE and BLE are disabled (BHE,
BLE HIGH), or during a write operation (CE LOW, and WE
LOW).Writing to the device is accomplished by taking Chip
Enable (CE) and Write Enable (WE) inputs LOW. If Byte Low
Enable (BLE) is LOW, then data from I/O pins (I/O0 through
I/O7), is written into the location specified on the address pins
(A0 through A16). If Byte High Enable (BHE) is LOW, then data
from I/O pins (I/O8 through I/O15) is written into the location
specified on the address pins (A0 through A16).Reading from
the device is accomplished by taking Chip Enable (CE) and
Output Enable (OE) LOW while forcing the Write Enable (WE)
HIGH. If Byte Low Enable (BLE) is LOW, then data from the
memory location specified by the address pins will appear on
I/O0 to I/O7. If Byte High Enable (BHE) is LOW, then data from
memory will appear on I/O8 to I/O15. See the truth table at the
back of this data sheet for a complete description of read and
write modes.
Features
• Temperature Ranges
— Industrial: –40°C to 85°C
— Automotive-A: –40°C to 85°C
— Automotive-E: –40°C to 125°C
• High Speed: 55 ns
• Wide voltage range: 2.7V–3.6V
• Ultra-low active, standby power
• Easy memory expansion with CE and OE features
• TTL-compatible inputs and outputs
• Automatic power-down when deselected
• CMOS for optimum speed/power
• Available in Pb-free 44-pin TSOP Type II package
Functional Description[1]
The CY62137VN is a high-performance CMOS static RAM
organized as 128K words by 16 bits. This device features
advanced circuit design to provide ultra-low active current.
This is ideal for providing More Battery Life™ (MoBL®) in
Logic Block Diagram
DATA IN DRIVERS
10
A10
A9
A8
A7
A6
A5
A4
A3
A2
128K x 16
RAM Array
I/O0–I/O7
I/O8–I/O15
A1
A0
COLUMN DECODER
BHE
WE
CE
OE
BLE
CE
Power-down
Circuit
BHE
BLE
Note:
1. For best practice recommendations, please refer to the Cypress application note “System Design Guidelines” on http://www.cypress.com.
Cypress Semiconductor Corporation
Document #: 001-06497 Rev. *A
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised August 3, 2006
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