是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | 27 X 27 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-676 |
针数: | 676 | Reach Compliance Code: | compliant |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.84 |
Is Samacsys: | N | 其他特性: | CAN ALSO OPERATE WITH 3.3V SUPPLY |
JESD-30 代码: | S-PBGA-B676 | JESD-609代码: | e0 |
长度: | 27 mm | 专用输入次数: | |
I/O 线路数量: | 302 | 端子数量: | 676 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
组织: | 0 DEDICATED INPUTS, 302 I/O | 输出函数: | MACROCELL |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | LBGA |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, LOW PROFILE |
峰值回流温度(摄氏度): | NOT SPECIFIED | 可编程逻辑类型: | LOADABLE PLD |
传播延迟: | 15 ns | 认证状态: | Not Qualified |
座面最大高度: | 1.6 mm | 最大供电电压: | 2.7 V |
最小供电电压: | 2.3 V | 标称供电电压: | 2.5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | BALL | 端子节距: | 1 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 27 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
CY39100V676A-200MBC | CYPRESS |
获取价格 |
Loadable PLD, 7.5ns, 1536-Cell, CMOS, PBGA676, 27 X 27 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBG | |
CY39100V676B-125MBC | ROCHESTER |
获取价格 |
LOADABLE PLD, 10 ns, PBGA676, 27 X 27 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-676 | |
CY39100V676B-200MBC | CYPRESS |
获取价格 |
Loadable PLD, 7.5ns, 1536-Cell, CMOS, PBGA676, 27 X 27 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBG | |
CY39100Z208-125BBC | CYPRESS |
获取价格 |
CPLDs at FPGA Densities | |
CY39100Z208-125BBI | CYPRESS |
获取价格 |
CPLDs at FPGA Densities | |
CY39100Z208-125BGC | CYPRESS |
获取价格 |
CPLDs at FPGA Densities | |
CY39100Z208-125BGI | CYPRESS |
获取价格 |
CPLDs at FPGA Densities | |
CY39100Z208-125MBC | CYPRESS |
获取价格 |
CPLDs at FPGA Densities | |
CY39100Z208-125MBI | CYPRESS |
获取价格 |
CPLDs at FPGA Densities | |
CY39100Z208-125MGC | CYPRESS |
获取价格 |
CPLDs at FPGA Densities |