Document 1223-1
Shielded Power Inductor CU8838-AL
• Soft saturation makes it ideal for VRD/VRM applications
• Special materials eliminate all thermal aging issues.
Core material Iron
Terminations RoHS tin-silver over copper.
Weight 4.9 g
Ambient temperature –40°C to +85°C with Irms current
Maximum part temperature: The part may be operated without
damage as long its temperature (ambient + self-heating) does not
exceed +125°C.
Storage temperature Component: –40°C to +125°C.
Tape and reel packaging: –40°C to +80°C
Resistance to soldering heat Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Moisture Sensitivity Level (MSL) 1 (unlimited floor life at <30°C /
85% relative humidity)
Failures in Time (FIT) / Mean Time Between Failures (MTBF)
38 per billion hours / 26,315,789 hours, calculated per Telcordia SR-332
Packaging 800/13″ reel Plastic tape: 24 mm wide, 0.3 mm thick,
12 mm pocket spacing, 6.1 mm pocket depth
PCB washing Tested to MIL-STD-202 Method 215 plus an additional
aqueous wash. See Doc787_PCB_Washing.pdf.
DCR (mOhm)
Isat (A)4
Irms (A)5
±2°C rise 42°C rise
Inductance2
±±20 (ꢀµ)
SRF typ3
(Mµz)
Part number1
typ
max
120 drop ±20 drop 320 drop
CU8838-AL_
1.0
1.75
2.0
100
27
45
63
18.5
26.0
1. When ordering, please specify packaging code:
CU8838-ALD
Packaging: D= 13″ machine-ready reel. EIA-481 embossed plastic
tape (800 parts per full reel).
B= Less than full reel. In tape, but not machine ready.
To have a leader and trailer added ($25 charge), use
code letter D instead.
2. Inductance measured at 100 kHz, 0.1 Vrms, 0 Adc using a Coilcraft
SMD-A fixture in an Agilent/HP 4284A LCR meter.
3. SRF measured using an Agilent/HP4291A impedance analyzer and a
Coilcraft 16193 fixture.
4. DC current at which the inductance drops the specified amount from its
value without current.
5. Current that causes the specified temperature rise from 25°C ambient.
6. Electrical specifications at 25°C.
Refer to Doc 362 “Soldering Surface Mount Components” before soldering.
inches
mm
Dimensions are in
Document 1223-1 Revised 10/17/14