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CS5N60A3H

更新时间: 2024-10-29 15:18:07
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CS5N60A3H 数据手册

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CS5N60 A3H  
R
The name and content of poisonous and harmful material in products  
Hazardous Substance  
Parts Name  
Pb  
Hg  
Cd  
Cr(VI)  
PBB  
PBDE  
0.1%  
0.1%  
0.01%  
0.1%  
0.1%  
0.1%  
Limit  
Lead Frame  
Molding Compound  
Chip  
×
Wire Bonding  
Solder  
○:means the hazardous material is under the criterion of SJ/T11363-2006.  
×:means the hazardous material exceeds the criterion of SJ/T11363-2006.  
The plumbum element of solder exist in products presently, but within the allowed  
range of Eurogroups RoHS.  
Note  
Warnings  
1. Exceeding the maximum ratings of the device in performance may cause damage to the device,  
even the permanent failure, which may affect the dependability of the machine. It is suggested  
to be used under 80 percent of the maximum ratings of the device.  
2. When installing the heatsink, please pay attention to the torsional moment and the smoothness  
of the heatsink.  
3. VDMOSFETs is the device which is sensitive to the static electricity, it is necessary to protect  
the device from being damaged by the static electricity when using it.  
4. This publication is made by Huajing Microelectronics and subject to regular change without  
notice.  
WUXI CHINA RESOURCES HUAJING MICROELECTRONICS CO., LTD.  
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