Datasheet > CRG01(TE85LQM)

CRG01(TE85LQM)

更新时间： 2024-11-07 14:41:31

品牌	Logo	应用领域
东芝 - TOSHIBA		二极管
页数	文件大小	规格书
4页	355K
描述
Rectifier Diode

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中文翻译

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技术参数
数据手册

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CRG01(TE85LQM) 技术参数

生命周期：	Active	Reach Compliance Code：	unknown
风险等级：	5.71	二极管类型：	RECTIFIER DIODE
Base Number Matches：	1

CRG01(TE85LQM) 数据手册

CRG01,CRG02

TOSHIBA Rectifier Silicon Diffused Type

CRG01, CRG02

○ General Power Supply Rectification

Unit: mm

•

Repetitive peak reverse voltage : V

= 100 V, 400 V

= 0.7 A

RRM

Average forward current

: I

F (AV)

Small, thin package suitable for high-density board assembly

Toshiba Nickname: “S-FLAT^TM

”

Absolute Maximum Ratings (Ta = 25°C)

Characteristics

Symbol

Rating

Unit

CRG01

CRG02

100

400

Repetitive peak reverse voltage

Average forward current

RRM

0.7

F(AV)

15 (50 Hz)

16.5 (60 Hz)

−40 to 150

Non-repetitive peak forward surge current

FSM

Junction temperature

Storage temperature

°C

JEDEC

JEITA

―

stg

Note: Using continuously under heavy loads (e.g. the application of high

temperature/current/voltage and the significant change in

temperature, etc.) may cause this product to decrease in the

reliability significantly even if the operating conditions (i.e.

TOSHIBA

3-2A1S

Weight: 0.013 g (typ.)

operating temperature/current/voltage, etc.) are within the absolute maximum ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report

and estimated failure rate, etc).

Electrical Characteristics (Ta = 25°C)

Characteristics

Symbol

Test Condition

= 0.1 A (pulse test)

Typ.

Max

Unit

0.88



1.1



FM (1)

FM (2)

FM (3)

Peak forward voltage

= 0.7 A (pulse test)

= 1.0 A (pulse test)

1.1



Repetitive peak reverse current

Thermal resistance

= Rated (pulse test)

RRM

µA

RRM

Device mounted on a ceramic board

board size

soldering land size

board thickness

50 mm × 50 mm

2 mm × 2 mm

0.64 mm



°C/W

th (j-a)

Device mounted on a glass-epoxy board

board size 50 mm × 50 mm

soldering land size 6 mm × 6 mm

130

board thickness

1.6 mm

Start of commercial production

1998-06

2018-08-30

12 3 4

中文翻译

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