Datasheet > CGA3E3X5R1H334M080AB_17

CGA3E3X5R1H334M080AB_17

更新时间： 2024-11-21 01:14:47

品牌	Logo	应用领域
东电化 - TDK		/
页数	文件大小	规格书
3页	235K
描述
Multilayer Ceramic Chip Capacitors

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CGA3E3X5R1H334M080AB_17 数据手册

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Creation Date : November 16, 2017 (GMT)

Multilayer Ceramic Chip Capacitors

CGA3E3X7R1E474K080AE

TDK item description CGA3E3X7R1E474KT***S

Applications

Feature

Automotive Grade

Soft Soft Termination

AEC-Q200 AEC-Q200

CGA3(1608) [EIA 0603]

Production

Series

Status

Size

1.60mm +0.20,-0.10mm

Length(L)

Width(W)

0.80mm +0.15,-0.10mm

0.20mm Min.

Thickness(T)

Terminal Width(B)

Terminal Spacing(G)

0.30mm Min.

0.70mm to 1.00mm(Flow Soldering)

0.60mm to 0.80mm(Reﬂow Soldering)

Recommended Land Pattern (PA)

Recommended Land Pattern (PB)

Recommended Land Pattern (PC)

0.80mm to 1.00mm(Flow Soldering)

0.60mm to 0.80mm(Reﬂow Soldering)

0.60mm to 0.80mm(Flow Soldering)

0.60mm to 0.80mm(Reﬂow Soldering)

Electrical Characteristics

Capacitance

470nF ±10%

25VDC

Rated Voltage

Temperature Characteristic

Dissipation Factor (Max.)

Insulation Resistance (Min.)

X7R(±15%)

1063MΩ

Other

Wave (Flow)

Reﬂow

Soldering Method

AEC-Q200

Yes

Packing

Punched (Paper)Taping [180mm Reel]

4000pcs

Package Quantity

! Images are for reference only and show exemplary products.

! This PDF document was created based on the data listed on the TDK Corporation website.

! All speciﬁcations are subject to change without notice.

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