CDCE401
www.ti.com
SCAS820–JUNE 2006
OSCILLATOR IC WITH ELECTRONIC CALIBRATION
FEATURES
Die Terminal Assignment
(Top View = Bond Pad View)
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Oscillator Gain Stage Implemented
One LVCMOS Frequency Output
Frequency Range of Oscillator Gain Stage =
20 MHz–100 MHz
1
2
3
4
EN
8
6
VDD
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Frequency Range of LVCMOS Output = 0.625
MHz–100 MHz
Electronic Trimming of Oscillator Using
Capacitance Arrays
XIN
SDATA
Programmable Post Dividers x, x/2, x/4, x/8,
x/16, x/32
XOUT
VSS
Nonvolatile Storage of Settings Using
EEPROM Technology
5
FOUT
Easy One-Wire In-Circuit Programming Allows
Programming and Trimming of Oscillator After
Manufacturing
» 1 mm ´ 1 mm
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EEPROM Programming Without the Need to
Apply High Voltage to the Device
M0018-03
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Available as Die
Small Form Factor From Less Than 1 mm × 1
mm, Allowing the Smallest Form Factor
Available for Today’s and Next-Generation
Oscillators
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Industrial Temperature Range –40°C to 85°C
Wide VDD Range: 2.25 V up to 3.3 V
ESD Protection Exceeds JESD22
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>2000-V Human-Body Model (A114-B)
>200-V Machine Model (A115_A)
>500-V Charged-Device Model (C101-B.01)
DESCRIPTION
The CDCE401 is designed to achieve today’s demanding challenges for crystal oscillator modules. The small
form factor of the unpackaged die or the QFN package reduces the space consumption of the device to the
technical minimum level of today’s silicon technology.
The on-die trimming capacitance allows frequency trimming of the oscillator module after the manufacturing
process. Therefore, by doing a post-manufacturing programming, crystal manufacturing tolerances can be
trimmed out.
During power up or with each enabling, the CDCE401 oscillator start-up circuit switches off all oscillator
capacitors (CXI, CXO, CBASE) to maximize negative impedance during start-up. After a certain time
(1/XTAL-frequency × 217 ~ 1.311 ms–6.554 ms), the capacitances are connected to tune to the trimmed
frequency range.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2006, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.