Chip Schottky Barrier Rectifier
CDBD2020-G Thru. CDBD20200-G
Reverse Voltage: 20 to 200 Volts
Forward Current: 20.0 Amp
RoHS Device
D2PAK
Features
-Batch process design, excellent power dissipation offers
current and thermal resistance.
better reverse leakage
0.402(10.20)
0.386(9.80)
-Low profile surface mounted application in order to
optimize board space.
0.046(1.20)
0.032(0.80)
0.185(4.70)
0.169(4.30)
-Low power loss, high efficiency.
0.055(1.40)
0.047(1.20)
-High current capability, low forward voltage drop.
-High surge capability.
2
-Guardring for overvoltage protection.
-Ultra high-speed switching.
-Silicon epitaxial planar chip, metal silicon junction.
0.370(9.40)
0.354(9.00)
0.012(0.30)
0.004(0.10)
1
3
0.024(0.60)
0.016(0.40)
0.192(4.8)
0.176(4.4)
-Lead-free parts meet environmental standards of
0.063(1.60)
0.055(1.40)
MIL-STD-19500 /228
0.108(2.70)
0.205(5.20)
0.189(4.80)
0.092(2.30)
Mechanical data
-Case: TO-263/D2PAK, molded plastic.
-Terminals: solderable per MIL-STD-750,
Dimensions in inches and (millimeters)
method 2026.
-Polarity: Indicated by cathode band.
-Weunting Position: Any
-Weight:1.46 gram(approx.).
PIN 1
PIN 3
PIN 2
Maximum Ratings (At Ta=25°C, unless otherwise noted)
CDBD
20200-G
CDBD CDBD CDBD CDBD CDBD CDBD CDBD CDBD CDBD
Symbol
VRRM
VR
Parameter
Unit
V
2020-G 2030-G 2040-G 2045-G 2050-G 2060-G 2080-G
20150-G
20100-G
Repetitive peak reverse voltage
200
200
140
20
20
14
30
30
21
40
40
28
45
45
50
50
35
60
60
42
80
80
56
100
150
Continuous reverse voltage
RMS voltage
V
100
70
150
105
VRMS
IO
V
31.5
Maximum Forward rectified current
(See fig. 1)
20.0
0.75
A
Maximum forward voltage
IF=10.0A
VF
V
A
0.55
0.85
1.00
Maxium Forward surge current, 8.3ms
singlehalf sine-wave superimposed on
rate load (JEDEC method)
IFSM
150
VR=VRRM TA=25°C
MaximumReverse
IR
IR
0.5
50
mA
mA
current
VR=VRRM TA=100°C
Typ.Thermal
Junction to Case
resistance
RθJc
2.0
°C/W
Operating temperature
Storage temperature
-55 to +125
-55 to +150
TJ
°C
°C
-65 to +175
TSTG
REV:A
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Comchip Technology CO., LTD.