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CDBD2030-G PDF预览

CDBD2030-G

更新时间: 2024-11-27 07:19:59
品牌 Logo 应用领域
上华 - COMCHIP /
页数 文件大小 规格书
4页 102K
描述
Chip Schottky Barrier Rectifier

CDBD2030-G 数据手册

 浏览型号CDBD2030-G的Datasheet PDF文件第2页浏览型号CDBD2030-G的Datasheet PDF文件第3页浏览型号CDBD2030-G的Datasheet PDF文件第4页 
Chip Schottky Barrier Rectifier  
CDBD2020-G Thru. CDBD20200-G  
Reverse Voltage: 20 to 200 Volts  
Forward Current: 20.0 Amp  
RoHS Device  
D2PAK  
Features  
-Batch process design, excellent power dissipation offers  
current and thermal resistance.  
better reverse leakage  
0.402(10.20)  
0.386(9.80)  
-Low profile surface mounted application in order to  
optimize board space.  
0.046(1.20)  
0.032(0.80)  
0.185(4.70)  
0.169(4.30)  
-Low power loss, high efficiency.  
0.055(1.40)  
0.047(1.20)  
-High current capability, low forward voltage drop.  
-High surge capability.  
2
-Guardring for overvoltage protection.  
-Ultra high-speed switching.  
-Silicon epitaxial planar chip, metal silicon junction.  
0.370(9.40)  
0.354(9.00)  
0.012(0.30)  
0.004(0.10)  
1
3
0.024(0.60)  
0.016(0.40)  
0.192(4.8)  
0.176(4.4)  
-Lead-free parts meet environmental standards of  
0.063(1.60)  
0.055(1.40)  
MIL-STD-19500 /228  
0.108(2.70)  
0.205(5.20)  
0.189(4.80)  
0.092(2.30)  
Mechanical data  
-Case: TO-263/D2PAK, molded plastic.  
-Terminals: solderable per MIL-STD-750,  
Dimensions in inches and (millimeters)  
method 2026.  
-Polarity: Indicated by cathode band.  
-Weunting Position: Any  
-Weight:1.46 gram(approx.).  
PIN 1  
PIN 3  
PIN 2  
Maximum Ratings (At Ta=25°C, unless otherwise noted)  
CDBD  
20200-G  
CDBD CDBD CDBD CDBD CDBD CDBD CDBD CDBD CDBD  
Symbol  
VRRM  
VR  
Parameter  
Unit  
V
2020-G 2030-G 2040-G 2045-G 2050-G 2060-G 2080-G  
20150-G  
20100-G  
Repetitive peak reverse voltage  
200  
200  
140  
20  
20  
14  
30  
30  
21  
40  
40  
28  
45  
45  
50  
50  
35  
60  
60  
42  
80  
80  
56  
100  
150  
Continuous reverse voltage  
RMS voltage  
V
100  
70  
150  
105  
VRMS  
IO  
V
31.5  
Maximum Forward rectified current  
(See fig. 1)  
20.0  
0.75  
A
Maximum forward voltage  
IF=10.0A  
VF  
V
A
0.55  
0.85  
1.00  
Maxium Forward surge current, 8.3ms  
singlehalf sine-wave superimposed on  
rate load (JEDEC method)  
IFSM  
150  
VR=VRRM TA=25°C  
MaximumReverse  
IR  
IR  
0.5  
50  
mA  
mA  
current  
VR=VRRM TA=100°C  
Typ.Thermal  
Junction to Case  
resistance  
RθJc  
2.0  
°C/W  
Operating temperature  
Storage temperature  
-55 to +125  
-55 to +150  
TJ  
°C  
°C  
-65 to +175  
TSTG  
REV:A  
Page 1  
QW-BB035  
Comchip Technology CO., LTD.  

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