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CD74HC166E PDF预览

CD74HC166E

更新时间: 2024-11-23 23:04:27
品牌 Logo 应用领域
德州仪器 - TI 移位寄存器触发器逻辑集成电路光电二极管
页数 文件大小 规格书
8页 58K
描述
High Speed CMOS Logic 8-Bit Parallel-In/Serial-Out Shift Register

CD74HC166E 技术参数

是否Rohs认证: 符合生命周期:Active
零件包装代码:DIP包装说明:DIP, DIP16,.3
针数:16Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.39.00.01
Factory Lead Time:1 week风险等级:0.76
其他特性:SISO OPERATION ALSO AVAILABLE计数方向:RIGHT
系列:HC/UHJESD-30 代码:R-PDIP-T16
JESD-609代码:e4长度:19.3 mm
负载电容(CL):50 pF逻辑集成电路类型:PARALLEL IN SERIAL OUT
最大频率@ Nom-Sup:20000000 Hz最大I(ol):0.0052 A
位数:8功能数量:1
端子数量:16最高工作温度:125 °C
最低工作温度:-55 °C输出极性:TRUE
封装主体材料:PLASTIC/EPOXY封装代码:DIP
封装等效代码:DIP16,.3封装形状:RECTANGULAR
封装形式:IN-LINE包装方法:TUBE
峰值回流温度(摄氏度):NOT SPECIFIED电源:2/6 V
最大电源电流(ICC):0.08 mAProp。Delay @ Nom-Sup:32 ns
传播延迟(tpd):240 ns认证状态:Not Qualified
施密特触发器:No座面最大高度:5.08 mm
子类别:Shift Registers最大供电电压 (Vsup):6 V
最小供电电压 (Vsup):2 V标称供电电压 (Vsup):4.5 V
表面贴装:NO技术:CMOS
温度等级:MILITARY端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
触发器类型:POSITIVE EDGE宽度:6.35 mm
最小 fmax:23 MHzBase Number Matches:1

CD74HC166E 数据手册

 浏览型号CD74HC166E的Datasheet PDF文件第2页浏览型号CD74HC166E的Datasheet PDF文件第3页浏览型号CD74HC166E的Datasheet PDF文件第4页浏览型号CD74HC166E的Datasheet PDF文件第5页浏览型号CD74HC166E的Datasheet PDF文件第6页浏览型号CD74HC166E的Datasheet PDF文件第7页 
CD74HC166,  
CD74HCT166  
Data sheet acquired from Harris Semiconductor  
SCHS157  
High Speed CMOS Logic  
February 1998  
8-Bit Parallel-In/Serial-Out Shift Register  
at V  
= 5V  
Features  
CC  
• HCT Types  
- 4.5V to 5.5V Operation  
• Buffered Inputs  
o
• Typical f  
MAX  
= 50MHz at V = 5V, C = 15pF, T = 25 C  
CC L A  
- Direct LSTTL Input Logic Compatibility,  
V = 0.8V (Max), V = 2V (Min)  
[ /Title  
(CD74  
HC166  
,
CD74  
HCT16  
6)  
• Fanout (Over Temperature Range)  
IL  
IH  
- CMOS Input Compatibility, I 1µA at V , V  
- Standard Outputs. . . . . . . . . . . . . . . 10 LSTTL Loads  
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads  
l
OL OH  
Ordering Information  
o
o
• Wide Operating Temperature Range . . . -55 C to 125 C  
• Balanced Propagation Delay and Transition Times  
TEMP. RANGE  
PKG.  
NO.  
o
PART NUMBER  
CD74HC166E  
CD74HCT166E  
CD74HC166M  
CD74HCT166M  
CD54HC166W  
NOTES:  
( C)  
PACKAGE  
16 Ld PDIP  
16 Ld PDIP  
16 Ld SOIC  
16 Ld SOIC  
Wafer  
• Significant Power Reduction Compared to LSTTL  
Logic ICs  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
E16.3  
E16.3  
/Sub-  
ject  
• HC Types  
- 2V to 6V Operation  
- High Noise Immunity: N = 30%, N = 30% of V  
IL IH CC  
M16.15  
M16.15  
(High  
Speed  
CMOS  
Logic  
8-Bit  
Paral-  
lel-  
1. When ordering, use the entire part number. Add the suffix 96 to  
obtain the variant in the tape and reel.  
2. Wafer and die is available which meets all electrical  
specifications. Please contact your local sales office or Harris  
customer service for ordering information.  
In/Seri  
Pinout  
CD74HC166, CD74HCT166 (PDIP, SOIC)  
TOP VIEW  
DS  
D0  
1
2
3
4
5
6
7
8
16 V  
CC  
15 PE  
14 D7  
13 Q7  
12 D6  
11 D5  
10 D4  
D1  
D2  
D3  
CE  
CP  
9
MR  
GND  
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.  
File Number 1501.1  
Copyright © Harris Corporation 1998  
1

CD74HC166E 替代型号

型号 品牌 替代类型 描述 数据表
CD54HCT166F3A TI

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High-Speed CMOS Logic 8-Bit Parallel-In/Serial-Out Shift Register
5962-8685501EA TI

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High-Speed CMOS Logic 8-Bit Parallel-In/Serial-Out Shift Register
CD54HC165F3A TI

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High-Speed CMOS Logic 8-Bit Parallel-In/Serial-Out Shift Register

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