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CC430F6125IRGCR PDF预览

CC430F6125IRGCR

更新时间： 2024-10-28 06:46:31
品牌 Logo 应用领域
德州仪器 - TI 电信集成电路电信电路射频PC
页数 文件大小 规格书
118页 1320K
描述
MSP430 SoC with RF Core

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中文翻译

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CC430F6125IRGCR 技术参数

是否无铅：不含铅是否Rohs认证：符合
生命周期：Active零件包装代码：QFN
包装说明：HVQCCN,针数：64
Reach Compliance Code：compliantECCN代码：5A992.C
HTS代码：8542.31.00.01风险等级：0.92
Samacsys Confidence：Samacsys Status：Released
Samacsys PartID：605378Samacsys Pin Count：65
Samacsys Part Category：Integrated CircuitSamacsys Package Category：Other
Samacsys Footprint Name：QFN50P900X900X100-65NSamacsys Released Date：2017-01-12 12:59:53
Is Samacsys：N数据速率：250 Mbps
JESD-30 代码：S-PQCC-N64JESD-609代码：e4
长度：9 mm湿度敏感等级：3
功能数量：1端子数量：64
最高工作温度：85 °C最低工作温度：-40 °C
封装主体材料：PLASTIC/EPOXY封装代码：HVQCCN
封装形状：SQUARE封装形式：CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度（摄氏度）：260认证状态：Not Qualified
座面最大高度：1 mm标称供电电压：2.2 V
表面贴装：YES电信集成电路类型：TELECOM CIRCUIT
温度等级：INDUSTRIAL端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式：NO LEAD端子节距：0.5 mm
端子位置：QUAD处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：9 mmBase Number Matches：1

CC430F6125IRGCR 数据手册

 浏览型号CC430F6125IRGCR的Datasheet PDF文件第2页浏览型号CC430F6125IRGCR的Datasheet PDF文件第3页浏览型号CC430F6125IRGCR的Datasheet PDF文件第4页浏览型号CC430F6125IRGCR的Datasheet PDF文件第5页浏览型号CC430F6125IRGCR的Datasheet PDF文件第6页浏览型号CC430F6125IRGCR的Datasheet PDF文件第7页 
ECCN 5E002 TSPA - Technology / Software Publicly Available  
CC430F613x  
CC430F612x  
CC430F513x  
www.ti.com  
SLAS554D –MAY 2009–REVISED JULY 2010  
MSP430 SoC with RF Core  
1
FEATURES  
•
True System-on-Chip (SoC) for Low-Power  
Wireless Communication Applications  
•
High-Performance Sub-1-GHz RF Transceiver  
Core  
•
•
Wide Supply Voltage Range: 1.8 V to 3.6 V  
Ultralow Power Consumption:  
–
–
–
Same as in CC1101  
Wide Supply Voltage Range: 2.0 V to 3.6 V  
–
–
–
–
CPU Active Mode (AM): 160 µA/MHz  
Standby Mode (LPM3 RTC Mode):2.0 µA  
Off Mode (LPM4 RAM Retention): 1.0 µA  
Radio in RX: 15 mA, 250 kbps, 915 MHz  
Frequency Bands: 300 MHz to 348 MHz,  
389 MHz to 464 MHz, and 779 MHz to  
928 MHz  
–
–
Programmable Data Rate From 0.6 kBaud  
to 500 kBaud  
•
MSP430™ System and Peripherals  
High Sensitivity (–117 dBm at 0.6 kBaud,  
-111 dBm at 1.2 kBaud, 315 MHz, 1% Packet  
Error Rate)  
–
–
–
16-Bit RISC Architecture, Extended  
Memory, up to 20-MHz System Clock  
Wake-Up From Standby Mode in Less  
Than 6 µs  
–
–
–
–
Excellent Receiver Selectivity and Blocking  
Performance  
Flexible Power Management System with  
SVS and Brownout  
Programmable Output Power Up to +12  
dBm for All Supported Frequencies  
–
–
Unified Clock System with FLL  
2-FSK, 2-GFSK, and MSK Supported as well  
as OOK and Flexible ASK Shaping  
16-Bit Timer TA0, Timer_A with Five  
Capture/Compare Registers  
Flexible Support for Packet-Oriented  
Systems: On-Chip Support for Sync Word  
Detection, Address Check, Flexible Packet  
Length, and Automatic CRC Handling  
–
16-Bit Timer TA1, Timer_A with Three  
Capture/Compare Registers  
–
–
Hardware Real-Time Clock  
Two Universal Serial Communication  
Interfaces  
–
Support for Automatic Clear Channel  
Assessment (CCA) Before Transmitting (for  
Listen-Before-Talk Systems)  
–
–
USCI_A0 supporting UART, IrDA, SPI  
USCI_B0 supporting I2C, SPI  
–
–
Digital RSSI Output  
Suited for Systems Targeting Compliance  
With EN 300 220 (Europe) and  
FCC CFR Part 15 (US)  
–
12-Bit A/D Converter With Internal  
Reference, Sample-and-Hold, and Autoscan  
Features (Only CC430F613x and  
CC430F513x)  
–
–
Suited for Systems Targeting Compliance  
With Wireless M-Bus Standard EN  
13757-4:2005  
–
–
Comparator  
Integrated LCD Driver With Contrast  
Control for up to 96 Segments (Only  
CC430F61xx)  
Support for Asynchronous and  
Synchronous Serial Receive/Transmit Mode  
for Backward Compatibility With Existing  
Radio Communication Protocols  
–
128-bit AES Security Encryption/Decryption  
Coprocessor  
•
•
Family Members are Summarized in Table 1.  
–
–
–
32-Bit Hardware Multiplier  
Three-Channel Internal DMA  
For Complete Module Descriptions, See the  
CC430 Family User's Guide (SLAU259).  
Serial Onboard Programming, No External  
Programming Voltage Needed  
–
Embedded Emulation Module (EEM)  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2009–2010, Texas Instruments Incorporated  
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中文翻译

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CC430F6125IRGCR 替代型号

型号 品牌 替代类型 描述 数据表
CC430F6125IRGCT TI

类似代替

 MSP430 SoC with RF Core
CC430F6125IRGC TI

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 MSP430 SoC with RF Core

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