Datasheet > 电信电路 > 其他电信集成电路> CC430F6135IRGCT

CC430F6135IRGCT

更新时间： 2024-10-28 06:46:31

品牌	Logo	应用领域
德州仪器 - TI		电信集成电路电信电路射频
页数	文件大小	规格书
118页	1320K
描述
MSP430 SoC with RF Core

阅读下载

中文翻译

获取价格

技术参数
数据手册
替代型号

如果您发现信息不准确，欢迎纠错

CC430F6135IRGCT 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Active	零件包装代码：	QFN
包装说明：	VQCCN,	针数：	64
Reach Compliance Code：	compliant	HTS代码：	8542.39.00.01
Factory Lead Time：	1 week	风险等级：	5.1
JESD-30 代码：	S-PQCC-N64	JESD-609代码：	e4
长度：	9 mm	湿度敏感等级：	3
功能数量：	1	端子数量：	64
最高工作温度：	85 °C	最低工作温度：	-40 °C
封装主体材料：	PLASTIC/EPOXY	封装代码：	VQCCN
封装形状：	SQUARE	封装形式：	CHIP CARRIER, VERY THIN PROFILE
峰值回流温度（摄氏度）：	260	认证状态：	Not Qualified
座面最大高度：	1 mm	标称供电电压：	2.2 V
表面贴装：	YES	电信集成电路类型：	TELECOM CIRCUIT
温度等级：	INDUSTRIAL	端子面层：	Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式：	NO LEAD	端子节距：	0.5 mm
端子位置：	QUAD	处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	9 mm	Base Number Matches：	1

CC430F6135IRGCT 数据手册

ECCN 5E002 TSPA - Technology / Software Publicly Available

CC430F613x

CC430F612x

CC430F513x

www.ti.com

SLAS554D –MAY 2009–REVISED JULY 2010

MSP430 SoC with RF Core

FEATURES

•

True System-on-Chip (SoC) for Low-Power

Wireless Communication Applications

•

High-Performance Sub-1-GHz RF Transceiver

Core

•

Wide Supply Voltage Range: 1.8 V to 3.6 V

Ultralow Power Consumption:

–

Same as in CC1101

Wide Supply Voltage Range: 2.0 V to 3.6 V

–

CPU Active Mode (AM): 160 µA/MHz

Standby Mode (LPM3 RTC Mode):2.0 µA

Off Mode (LPM4 RAM Retention): 1.0 µA

Radio in RX: 15 mA, 250 kbps, 915 MHz

Frequency Bands: 300 MHz to 348 MHz,

389 MHz to 464 MHz, and 779 MHz to

928 MHz

–

Programmable Data Rate From 0.6 kBaud

to 500 kBaud

•

MSP430™ System and Peripherals

High Sensitivity (–117 dBm at 0.6 kBaud,

-111 dBm at 1.2 kBaud, 315 MHz, 1% Packet

Error Rate)

–

16-Bit RISC Architecture, Extended

Memory, up to 20-MHz System Clock

Wake-Up From Standby Mode in Less

Than 6 µs

–

Excellent Receiver Selectivity and Blocking

Performance

Flexible Power Management System with

SVS and Brownout

Programmable Output Power Up to +12

dBm for All Supported Frequencies

–

Unified Clock System with FLL

2-FSK, 2-GFSK, and MSK Supported as well

as OOK and Flexible ASK Shaping

16-Bit Timer TA0, Timer_A with Five

Capture/Compare Registers

Flexible Support for Packet-Oriented

Systems: On-Chip Support for Sync Word

Detection, Address Check, Flexible Packet

Length, and Automatic CRC Handling

–

16-Bit Timer TA1, Timer_A with Three

Capture/Compare Registers

–

Hardware Real-Time Clock

Two Universal Serial Communication

Interfaces

–

Support for Automatic Clear Channel

Assessment (CCA) Before Transmitting (for

Listen-Before-Talk Systems)

–

USCI_A0 supporting UART, IrDA, SPI

USCI_B0 supporting I²C, SPI

–

Digital RSSI Output

Suited for Systems Targeting Compliance

With EN 300 220 (Europe) and

FCC CFR Part 15 (US)

–

12-Bit A/D Converter With Internal

Reference, Sample-and-Hold, and Autoscan

Features (Only CC430F613x and

CC430F513x)

–

Suited for Systems Targeting Compliance

With Wireless M-Bus Standard EN

13757-4:2005

–

Comparator

Integrated LCD Driver With Contrast

Control for up to 96 Segments (Only

CC430F61xx)

Support for Asynchronous and

Synchronous Serial Receive/Transmit Mode

for Backward Compatibility With Existing

Radio Communication Protocols

–

128-bit AES Security Encryption/Decryption

Coprocessor

•

Family Members are Summarized in Table 1.

–

32-Bit Hardware Multiplier

Three-Channel Internal DMA

For Complete Module Descriptions, See the

CC430 Family User's Guide (SLAU259).

Serial Onboard Programming, No External

Programming Voltage Needed

–

Embedded Emulation Module (EEM)

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

12 3 4 5 6 7...118

中文翻译

下载PDF

CC430F6135IRGCT 替代型号

型号	品牌	替代类型	描述	数据表
CC430F6135IRGCR	TI	功能相似	MSP430 SoC with RF Core
CC430F6135IRGC	TI	功能相似	MSP430 SoC with RF Core

与CC430F6135IRGCT相关器件

型号	品牌	获取价格	描述	数据表
CC430F6137	TI	获取价格	ULTRA-LOW-POWER MICROCONTROLLERS
CC430F6137_14	TI	获取价格	MSP430â¢ SoC With RF Core
CC430F6137IRGC	TI	获取价格	MSP430 SoC with RF Core
CC430F6137IRGCR	TI	获取价格	MSP430 SoC with RF Core
CC430F6137IRGCT	TI	获取价格	MSP430 SoC with RF Core
CC430F613X	TI	获取价格	MSP430 SoC with RF Core
CC430F613X_12	TI	获取价格	MSP430? SoC with RF Core
CC430F6143	TI	获取价格	MSP430 SoC With RF Core
CC430F6143IRGC	TI	获取价格	MSP430 SoC With RF Core
CC430F6143IRGCR	TI	获取价格	MSP430 SoC With RF Core

与CC430F6135IRGCT相关文章

三星深化印度制造布局，供应链本地化进程加速
2024-10-29

12
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
2024-10-29

13
纳微科技震撼发布GaNSlim革新氮化镓功率芯片
2024-10-18

39
意法半导体发布第四代SiC技术，助力电动汽车电驱
2024-10-15

46

产品中心

服务支持

精选活动

关于我们

帮助中心

CC430F6135IRGCT

CC430F6135IRGCT 技术参数

CC430F6135IRGCT 数据手册

CC430F6135IRGCT 替代型号

与CC430F6135IRGCT相关器件

与CC430F6135IRGCT相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

CC430F6135IRGCT

CC430F6135IRGCT 技术参数

CC430F6135IRGCT 数据手册

CC430F6135IRGCT 替代型号

与CC430F6135IRGCT相关器件

与CC430F6135IRGCT相关文章

您还可以找

您在本页遇到什么问题？