是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | QFN | 包装说明: | VQFN-64 |
针数: | 64 | Reach Compliance Code: | compliant |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.22 |
Samacsys Confidence: | Samacsys Status: | Released | |
Samacsys PartID: | 605382 | Samacsys Pin Count: | 65 |
Samacsys Part Category: | Integrated Circuit | Samacsys Package Category: | Other |
Samacsys Footprint Name: | QFN50P900X900X100-65N | Samacsys Released Date: | 2017-01-12 12:59:53 |
Is Samacsys: | N | JESD-30 代码: | S-PQCC-N64 |
JESD-609代码: | e4 | 长度: | 9 mm |
湿度敏感等级: | 3 | 功能数量: | 1 |
端子数量: | 64 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | VQCCN | 封装形状: | SQUARE |
封装形式: | CHIP CARRIER, VERY THIN PROFILE | 峰值回流温度(摄氏度): | 260 |
认证状态: | Not Qualified | 座面最大高度: | 1 mm |
标称供电电压: | 2.2 V | 表面贴装: | YES |
电信集成电路类型: | TELECOM CIRCUIT | 温度等级: | INDUSTRIAL |
端子面层: | NICKEL PALLADIUM GOLD | 端子形式: | NO LEAD |
端子节距: | 0.5 mm | 端子位置: | QUAD |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 9 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
CC430F6126IRGCR | TI |
完全替代 |
MSP430 SoC with RF Core | |
CC430F6126IRGC | TI |
功能相似 |
MSP430 SoC with RF Core |
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CC430F6127 | TI |
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ULTRA-LOW-POWER MICROCONTROLLERS | |
CC430F6127IRGC | TI |
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MSP430 SoC with RF Core | |
CC430F6127IRGCR | TI |
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MSP430 SoC with RF Core | |
CC430F6127IRGCT | TI |
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MSP430 SoC with RF Core | |
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MSP430 SoC with RF Core | |
CC430F613 | TI |
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MSP430 SoC with RF Core | |
CC430F6135 | TI |
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ULTRA-LOW-POWER MICROCONTROLLERS | |
CC430F6135IRGC | TI |
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MSP430 SoC with RF Core | |
CC430F6135IRGCR | TI |
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MSP430 SoC with RF Core | |
CC430F6135IRGCT | TI |
获取价格 |
MSP430 SoC with RF Core |