是否无铅: | 不含铅 | 生命周期: | End Of Life |
零件包装代码: | DIP | 包装说明: | DIP, DIP8,.3 |
针数: | 8 | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.32.00.51 |
风险等级: | 6.55 | Samacsys Confidence: | 3 |
Samacsys Status: | Released | Samacsys PartID: | 224575 |
Samacsys Pin Count: | 8 | Samacsys Part Category: | Integrated Circuit |
Samacsys Package Category: | Dual-In-Line Packages | Samacsys Footprint Name: | PDIP-8(N)_1 |
Samacsys Released Date: | 2015-07-30 01:46:15 | Is Samacsys: | N |
最大时钟频率 (fCLK): | 0.4 MHz | 数据保留时间-最小值: | 100 |
耐久性: | 1000000 Write/Erase Cycles | I2C控制字节: | 1010DDMR |
JESD-30 代码: | R-PDIP-T8 | JESD-609代码: | e4 |
长度: | 9.27 mm | 内存密度: | 1048576 bit |
内存集成电路类型: | EEPROM | 内存宽度: | 8 |
功能数量: | 1 | 端子数量: | 8 |
字数: | 131072 words | 字数代码: | 128000 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 组织: | 128KX8 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | DIP |
封装等效代码: | DIP8,.3 | 封装形状: | RECTANGULAR |
封装形式: | IN-LINE | 并行/串行: | SERIAL |
峰值回流温度(摄氏度): | NOT SPECIFIED | 电源: | 3/5 V |
认证状态: | Not Qualified | 座面最大高度: | 5.33 mm |
串行总线类型: | SPI | 最大待机电流: | 0.000002 A |
子类别: | EEPROMs | 最大压摆率: | 0.003 mA |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 1.8 V |
标称供电电压 (Vsup): | 3.3 V | 表面贴装: | NO |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Nickel/Palladium/Gold (Ni/Pd/Au) | 端子形式: | THROUGH-HOLE |
端子节距: | 2.54 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 7.62 mm |
最长写入周期时间 (tWC): | 5 ms | 写保护: | HARDWARE |
Base Number Matches: | 1 |
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