Datasheet > C2012X6S1E155M125AB_17

C2012X6S1E155M125AB_17

更新时间： 2024-11-07 01:17:39

品牌	Logo	应用领域
东电化 - TDK		/
页数	文件大小	规格书
3页	238K
描述
Multilayer Ceramic Chip Capacitors

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Creation Date : May 19, 2017 (GMT)

Multilayer Ceramic Chip Capacitors

C2012X6S1E155K125AB

TDK item description C2012X6S1E155KT****

Applications

Commercial Grade

Feature

Series

Status

General General (Up to 50V)

C2012 [EIA 0805]

Production (Not Recommended for New Design)

Size

Length(L)

2.00mm ±0.20mm

Width(W)

1.25mm ±0.20mm

0.20mm Min.

Thickness(T)

Terminal Width(B)

Terminal Spacing(G)

0.50mm Min.

1.00mm to 1.30mm(Flow Soldering)

0.90mm to 1.20mm(Reﬂow Soldering)

Recommended Land Pattern (PA)

Recommended Land Pattern (PB)

Recommended Land Pattern (PC)

1.00mm to 1.20mm(Flow Soldering)

0.70mm to 0.90mm(Reﬂow Soldering)

0.80mm to 1.10mm(Flow Soldering)

0.90mm to 1.20mm(Reﬂow Soldering)

Electrical Characteristics

Capacitance

1.5μF ±10%

25VDC

Rated Voltage

Temperature Characteristic

Dissipation Factor (Max.)

Insulation Resistance (Min.)

X6S(±22%)

333MΩ

Other

Wave (Flow)

Reﬂow

Soldering Method

AEC-Q200

Packing

Blister (Plastic)Taping [180mm Reel]

2000pcs

Package Quantity

! Images are for reference only and show exemplary products.

! This PDF document was created based on the data listed on the TDK Corporation website.

! All speciﬁcations are subject to change without notice.

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