Datasheet > C2012X6S1H105M125AB

C2012X6S1H105M125AB

更新时间： 2024-11-07 01:22:47

品牌	Logo	应用领域
东电化 - TDK		/
页数	文件大小	规格书
1页	138K
描述
Multilayer Ceramic Chip Capacitors

阅读下载

中文翻译

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

C2012X6S1H105M125AB 数据手册

C2012X6S1H105K125AB

TDK Item Description : C2012X6S1H105KT****

DC Bias Characteristic

-10

-20

-30

-40

-50

-60

-70

-80

-90

Application & Main Feature

Commercial Grade ( General (Up to 50V) )

Series

C2012 [EIA CC0805]

DC Bias/V

Dimensions

2.00mm +/-0.2mm

1.25mm +/-0.2mm

0.20mm Min.

|Z|, ESR vs. Freq. Characteristics

Temperature Characteristics

10000

1000

100

0.50mm Min.

-10

-20

-30

-40

-50

-60

-70

-80

-90

Temperature Characteristic

X6S (-55 to 105 degC +/-22%)

0.1

0.01

0.001

Rated Voltage

1H (50Vdc)

0.001

0.01

0.1

100

1000

-80

-60

-40

-20

100

120

Capacitance

Temperature/degC

Frequency/MHz

1uF

|Z|

ESR

Temp.Chara.

TCBias(1/2Rated)

Capacitance Tolerance

Cap. vs. Freq. Characteristic

Ripple Temperature Rise Characteristics

K (+/-10%)

Dissipation Factor

5% Max.

Insulation Resistance

500Mohm Min.

AEC-Q200

Not Applicable

0.1

0.5

1.5

2.5

0.001

0.01

0.1

100

1000

Current/Arms

Frequency/MHz

100kHz

500kHz

1MHz

January 3, 2016

All specifications are subject to change without notice.

中文翻译

下载PDF

与C2012X6S1H105M125AB相关器件

型号	品牌	获取价格	描述	数据表
C2012X6S1H105M125AB_17	TDK	获取价格	Multilayer Ceramic Chip Capacitors
C2012X6S1H105WTXXXX	TDK	获取价格	General Application
C2012X6S1H107B020AA	TDK	获取价格	MULTILAYER CERAMIC CHIP CAPACITORS
C2012X6S1H107B030AA	TDK	获取价格	MULTILAYER CERAMIC CHIP CAPACITORS
C2012X6S1H107C020AA	TDK	获取价格	MULTILAYER CERAMIC CHIP CAPACITORS
C2012X6S1H107C030AA	TDK	获取价格	MULTILAYER CERAMIC CHIP CAPACITORS
C2012X6S1H107D020AA	TDK	获取价格	MULTILAYER CERAMIC CHIP CAPACITORS
C2012X6S1H107D030AA	TDK	获取价格	MULTILAYER CERAMIC CHIP CAPACITORS
C2012X6S1H107F020AA	TDK	获取价格	MULTILAYER CERAMIC CHIP CAPACITORS
C2012X6S1H107G020AA	TDK	获取价格	MULTILAYER CERAMIC CHIP CAPACITORS