Datasheet > C2012X6S1H474M125AB_17

C2012X6S1H474M125AB_17

更新时间： 2024-11-06 01:06:43

品牌	Logo	应用领域
东电化 - TDK		/
页数	文件大小	规格书
3页	237K
描述
Multilayer Ceramic Chip Capacitors

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Creation Date : February 27, 2017

(GMT)

Multilayer Ceramic Chip Capacitors

C2012X7R2A683K085AA

TDK item description C2012X7R2A683KT****

Commercial Grade

Applications

Please refer to Part No. CGA4F2X7R2A683K085AA for Automotive use.

Mid Mid Voltage (100 to 630V)

C2012 [EIA 0805]

Production (Not Recommended for New Design)

Feature

Series

Status

Size

2.00mm ±0.20mm

Length(L)

Width(W)

1.25mm ±0.20mm

0.85mm ±0.15mm

0.20mm Min.

Thickness(T)

Terminal Width(B)

Terminal Spacing(G)

0.50mm Min.

1.00mm to 1.30mm(Flow Soldering)

0.90mm to 1.20mm(Reﬂow Soldering)

Recommended Land Pattern (PA)

Recommended Land Pattern (PB)

Recommended Land Pattern (PC)

1.00mm to 1.20mm(Flow Soldering)

0.70mm to 0.90mm(Reﬂow Soldering)

0.80mm to 1.10mm(Flow Soldering)

0.90mm to 1.20mm(Reﬂow Soldering)

Electrical Characteristics

Capacitance

68nF ±10%

100VDC

X7R(±15%)

Rated Voltage

Temperature Characteristic

Dissipation Factor (Max.)

Insulation Resistance (Min.)

7352MΩ

Other

Wave (Flow)

Reﬂow

Soldering Method

AEC-Q200

Packing

Punched (Paper)Taping [180mm Reel]

4000pcs

Package Quantity

! Images are for reference only and show exemplary products.

! This PDF document was created based on the data listed on the TDK Corporation website.

! All speciﬁcations are subject to change without notice.

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