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C2012X6S1E475K125AC_17 PDF预览

C2012X6S1E475K125AC_17

更新时间: 2024-11-06 01:17:39
品牌 Logo 应用领域
东电化 - TDK /
页数 文件大小 规格书
3页 235K
描述
Multilayer Ceramic Chip Capacitors

C2012X6S1E475K125AC_17 数据手册

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1 of 3  
Creation Date : February 24, 2017  
(GMT)  
Multilayer Ceramic Chip Capacitors  
C2012JB2A222K085AA  
TDK item description C2012JB2A222KT****  
Applications  
Commercial Grade  
Feature  
Series  
Status  
Mid Mid Voltage (100 to 630V)  
C2012 [EIA 0805]  
Production (Not Recommended for New Design)  
Size  
Length(L)  
2.00mm ±0.20mm  
Width(W)  
1.25mm ±0.20mm  
0.85mm ±0.15mm  
0.20mm Min.  
Thickness(T)  
Terminal Width(B)  
Terminal Spacing(G)  
0.50mm Min.  
1.00mm to 1.30mm(Flow Soldering)  
0.90mm to 1.20mm(Reflow Soldering)  
Recommended Land Pattern (PA)  
Recommended Land Pattern (PB)  
Recommended Land Pattern (PC)  
1.00mm to 1.20mm(Flow Soldering)  
0.70mm to 0.90mm(Reflow Soldering)  
0.80mm to 1.10mm(Flow Soldering)  
0.90mm to 1.20mm(Reflow Soldering)  
Electrical Characteristics  
Capacitance  
2.2nF ±10%  
100VDC  
JB(±10%)  
3%  
Rated Voltage  
Temperature Characteristic  
Dissipation Factor (Max.)  
Insulation Resistance (Min.)  
10000MΩ  
Other  
Wave (Flow)  
Reflow  
Soldering Method  
AEC-Q200  
No  
Packing  
Punched (Paper)Taping [180mm Reel]  
4000pcs  
Package Quantity  
! Images are for reference only and show exemplary products.  
! This PDF document was created based on the data listed on the TDK Corporation website.  
! All specifications are subject to change without notice.  
Copyright(c) TDK Corporation. All rights reserved.  

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