CERAMIC CHIP CAPACITORS
FEATURES
• C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics
• Tape and reel packaging per EIA481-1. (See page
92 for specific tape and reel information.) Bulk
Cassette packaging (0402, 0603, 0805 only) per
IEC60286-6 and EIAJ 7201.
• 10, 16, 25, 50, 100 and 200 Volts
• Standard End Metalization: Tin-plate over nickel
barrier
• Available Capacitance Tolerances: 0.10 pFꢁ 0.25
pFꢁ 0.5 pFꢁ 1ꢀꢁ 2ꢀꢁ 5ꢀꢁ 10ꢀꢁ 20ꢀꢁ and
+80ꢀ-20ꢀ
• RoHS Compliant
CAPACITOR OUTLINE DRAWINGS
TIN PLATE
L
W
B
T
NICKEL PLATE
S
CONDUCTIVE
METALLIZATION
ELECTRODES
DIMENSIONS—MILLIMETERS AND (INCHES)
METRIC
S
EIA
SIZE CODE
EIA SIZE
METRIC
T
MOUNTING
TECHNIQUE
L - LENGTH
W - WIDTH
B - BANDWIDTH
SEPARATION
minimum
SIZE CODE
(Ref only)
CODE
SIZE CODE
THICKNESS
0402*
1005
0201*
0603
0.6 (.024) .03 (.001)
1.0 (.04) .05 (.002)
1.6 (.063) .15 (.006)
2.0 (.079) .20 (.008)
3.2 (.126) .20 (.008)
3.2 (.126) .20 (.008)
4.5 (.177) .30 (.012)
4.5 (.177) .30 (.012)
5.6 (.220) .40 (.016)
5.6 (.220) .40 (.016)
0.3 (.012) .03 (.001)
0.5 (.02) .05 (.002)
0.8 (.032) .15 (.006)
1.25 (.049) .20 (.008)
1.6 (.063) .20 (.008)
2.5 (.098) .20 (.008)
3.2 (.126) .30 (.012)
6.4 (.252) .40 (.016)
5.0 (.197) .40 (.016)
6.3 (.248) .40 (.016)
0.15 (.006) .05 (.002)
0.20 (.008) -.40 (.016)
0.35 (.014) .15 (.006)
0.50 (.02) .25 (.010)
0.50 (.02) .25 (.010)
0.50 (.02) .25 (.010)
0.60 (.024) .35 (.014)
0.60 (.024) .35 (.014)
0.60 (.024) .35 (.014)
0.60 (.024) .35 (.014)
N/A
0.3 (.012)
0.7 (.028)
0.75 (.030)
N/A
0603*
1608
Solder Reflow
0402*
1005
0805*
2012
or
Solder Wave +
or
0603
1608
1206*
3216
0805*
1210*
1206*
2012
3225
3216
See page 77
for thickness
dimensions.
Solder Reflow
1812
4532
1210*
3225
N/A
N/A
N/A
N/A
1825*
4564
Solder
Reflow
1812
4532
2220
5650
1825*
4564
Solder Reflow
2225
5664
5650
5664
2220
2225
N/A
* Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk bassette, see page 96.)
+ For extended value 1210 case size - solder reflow only.
(Standard Chips - For
Military see page 90)
CAPACITOR ORDERING INFORMATION
C 0805 C 103 K 5 R A C*
CERAMIC
END METALLIZATION
SIZE CODE
C-Standard (Tin-plated nickel barrier)
SPECIFICATION
C - Standard
FAILURE RATE LEVEL
CAPACITANCE CODE
A- Not Applicable
Expressed in Picofarads (pF)
First two digits represent significant figures.
Third digit specifies number of zeros. (Use 9
for 1.0 through 9.9pF. Use 8 for 0.5 through 0.99pF)
(Example: 2.2pF = 229 or 0.50 pF = 508)
CAPACITANCE TOLERANCE
B – 0.10pF J – 5ꢀ
TEMPERATURE CHARACTERISTIC
Designated by Capacitance
Change Over Temperature Range
G – C0G (NP0) ( 30 PPMꢂ/C)
R – X7R ( 15ꢀ) (-55/C + 125/C)
P– X5R ( 15ꢀ) (-55/C + 85/C)
U – Z5U (+22ꢀ, -56ꢀ) (+10/C + 85/C)
V – Y5V (+22ꢀ, -82ꢀ) (-30/C + 85/C)
VOLTAGE
C – 0.25pF K – 10ꢀ
D – 0.5pF
F – 1ꢀ
G – 2ꢀ
M – 20ꢀ
P – (GMV) – special order only
Z – +80ꢀ, -20ꢀ
1 - 100V
2 - 200V
5 - 50V
7 - 4V
3 - 25V
4 - 16V
8 - 10V
9 - 6.3V
* Part Number Example: C0805C103K5RAC (14 digits - no spaces)
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
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