BZD27C Series
Vishay Semiconductors
www.vishay.com
Zener Diodes with Surge Current Specification
FEATURES
eSMP® Series
Available
• Sillicon planar Zener diodes
• Low profile surface-mount package
• Zener and surge current specification
• Low leakage current
1
2
• Excellent stability
23018
• Meets MSL level 1, per J-STD-020, LF maximum peak
of 260 °C
23019
SMF (DO-219AB)
• Meets JESD 201 class 2 whisker test
• ESD capability according to AEC-Q101:
human body model: > 8 kV
machine model: > 800 V
LINKS TO ADDITIONAL RESOURCES
3
D
3D Models
• Wave and reflow solderable
• AEC-Q101 qualified available
PRIMARY CHARACTERISTICS
• Base P/N-E3 - RoHS-compliant, and commercial grade
PARAMETER
VZ range nom.
Test current IZT
VBR
VWM
PPPM
VALUE
3.6 to 200
5 to 100
7 to 188
6.2 to 160
150
UNIT
•
Base P/N-HE3 - RoHS-compliant, and AEC-Q101 qualified
V
mA
V
V
W
°C
• Compatible to SOD-123W package case outline or
SOD-123F and SOD-123FL
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
TJ max.
175
VZ specification
Circuit configuration
Polarity
Pulse current
Single
Uni-directional
ORDERING INFORMATION
DEVICE NAME
ORDERING CODE
TAPED UNITS PER REEL
MINIMUM ORDER QUANTITY
BZD27C3V6P-E3-08 to BZD27C200P-E3-08
BZD27C3V6P-HE3-08 to BZD27C200P-HE3-08
BZD27C3V6P-E3-18 to BZD27C200P-E3-18
BZD27C3V6P-HE3-18 to BZD27C200P-HE3-18
3000 per 7" reel (8 mm tape)
MOQ = 30K
BZD27C Series
10 000 per 13" reel (8 mm tape)
MOQ = 50K
PACKAGE
MOLDING COMPOUND MOISTURESENSITIVITY WHISKER TEST
PACKAGE NAME WEIGHT
SOLDERING CONDITIONS
FLAMMABILITY RATING
LEVEL
ACC. JESD 201
MSL level 1
(according J-STD-020)
SMF (DO-219AB)
15 mg
UL 94 V-0
class 2
Peak temperature max. 260 °C
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
VALUE
2300
800
300
150
UNIT
mW
mW
W
W
K/W
TL = 105 °C
TA = 30 °C (1)
Ptot
Ptot
Power dissipation
100 μs square pulse
10/1000 μs waveform
PZSM
PRSM
RthJL
Non repetitive peak surge power dissipation (2)
Junction to lead
30
Mounted on epoxy-glass PCB with
3 mm x 3 mm Cu pads (≥ 40 μm thick)
Junction to ambient air
RthJA
180
K/W
Junction temperature
Storage temperature range
Operating temperature range
Tj
Tstg
Top
175
-65 to +175
-65 to +175
°C
°C
°C
Notes
(1)
Mounted on epoxy-glass PCB with 3 mm x 3 mm Cu pads (≥ 40 μm thick)
TJ = 25 °C prior to surge
(2)
Rev. 2.0, 26-Feb-2021
Document Number: 85153
1
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000