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BYV430K-300P PDF预览

BYV430K-300P

更新时间: 2022-02-26 14:16:50
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11页 340K
描述
Dual ultrafast power diode

BYV430K-300P 数据手册

 浏览型号BYV430K-300P的Datasheet PDF文件第2页浏览型号BYV430K-300P的Datasheet PDF文件第3页浏览型号BYV430K-300P的Datasheet PDF文件第4页浏览型号BYV430K-300P的Datasheet PDF文件第6页浏览型号BYV430K-300P的Datasheet PDF文件第7页浏览型号BYV430K-300P的Datasheet PDF文件第8页 
WeEn Semiconductors  
BYV430K-300P  
Dual ultrafast power diode  
8. Thermal characteristics  
Table 5. Thermal characteristics  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
Rth(j-mb)  
thermal resistance  
from junction to  
mounting base  
with heatsink compound; per diode;  
Fig. 5  
-
0.8  
2
K/W  
with heatsink compound; both diodes  
conducting  
-
-
-
1.2  
-
K/W  
K/W  
Rth(j-a)  
thermal resistance  
from junction to  
ambient free air  
in free air  
45  
aaa-014272  
10  
th(j-mb)  
(K/W)  
Z
1
-1  
-2  
-3  
-4  
10  
10  
10  
10  
δ = 0.5  
δ = 0.3  
t
p
δ = 0.1  
P
δ =  
T
δ = 0.05  
single pulse  
t
t
p
T
-6  
-5  
-4  
-3  
-2  
-1  
10  
10  
10  
10  
10  
10  
1
10  
t
p
(s)  
Fig. 5. Transient thermal impedance from junction to mounting base as a function of pulse duration  
©
BYV430K-300P  
All information provided in this document is subject to legal disclaimers.  
WeEn Semiconductors Co., Ltd. 2018. All rights reserved  
Product data sheet  
26 September 2018  
5 / 11  
 
 

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