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BYD167A PDF预览

BYD167A

更新时间: 2024-11-13 09:03:31
品牌 Logo 应用领域
EIC 整流二极管瞄准线
页数 文件大小 规格书
2页 104K
描述
ULTRA FAST LOW-LOSS RECTIFIER

BYD167A 技术参数

是否无铅: 不含铅生命周期:Active
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:5.76Is Samacsys:N
Base Number Matches:1

BYD167A 数据手册

 浏览型号BYD167A的Datasheet PDF文件第2页 
TH97/10561QM  
TW00/17276EM  
IATF 0060636  
SGS TH07/1033  
ULTRA FAST LOW-LOSS RECTIFIER  
BYD167A  
SMA (DO-214AC)  
PRV : 600 Volts  
Io : 2.0 Amperes  
1.1 ± 0.3  
FEATURES :  
* Glass passivated junction chip  
* High maximum operating temperature  
* Low leakage current  
0.2 ± 0.07  
1.2 ± 0.2  
2.1 ± 0.2  
2.6 ± 0.15  
* Excellent stability  
* Smallest surface mount rectifier outline  
* Pb / RoHS Free  
2.0 ± 0.2  
MECHANICAL DATA :  
* Case : SMA Molded plastic  
Dimensions in millimeters  
* Epoxy : UL94V-O rate flame retardant  
* Lead : Lead Formed for Surface Mount  
* Polarity : Color band denotes cathode end  
* Mounting position : Any  
* Weight : 0.067 gram  
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS  
Rating at 25 °C ambient temperature unless otherwise specified.  
RATING  
VALUE  
SYMBOL  
UNIT  
600  
VRRM  
VR  
Maximum Repetitive Peak Reverse Voltage  
V
V
600  
Maximum Continuous Reverse Voltage  
2.0  
IF(AV)  
IFSM  
VF  
Maximum Average Forward Current (Note 1)  
Maximum Non-Repetitive Peak Forward Surge Current (Note 2)  
Maximum Forward Voltage at IF = 1.0 A, TJ = 25 °C  
A
25  
A
1.25  
V
5.0  
150  
Maximum Reverse Current at VR = VRRMmax  
TJ = 25 °C  
IR  
μA  
μA  
ns  
TJ = 150 °C  
IR(H)  
Trr  
50  
Maximum Reverse Recovery Time (Note 3)  
Thermal Resistance from Junction to Tie-Point  
30  
Rth j-tp  
Rth j-a  
TJ  
K / W  
K / W  
°C  
150  
Thermal Resistance from Junction to Ambient (Note 4)  
Junction Temperature Range  
- 65 to + 175  
- 65 to + 175  
TSTG  
Storage Temperature Range  
°C  
Notes :  
(1) Ttp = 70 °C; averaged over any 20 ms period; see Fig. 1  
(2) t=10ms half sine wave; Tj = Tjmax prior to surge; V = VRRMmax  
R
(3) Reverse Recovery Test Conditions :FI= 0.5 A, IR = 1.0 A, Irr = 0.25 A.  
(4) Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer40 μm.  
Page 1 of 2  
Rev. 00 : February 13, 2008  

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