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BUK9616-55A PDF预览

BUK9616-55A

更新时间: 2024-11-28 22:50:23
品牌 Logo 应用领域
恩智浦 - NXP 晶体晶体管
页数 文件大小 规格书
9页 104K
描述
TrenchMOS transistor standard level FET

BUK9616-55A 技术参数

是否Rohs认证: 符合生命周期:Transferred
包装说明:PLASTIC, D2PAK-3针数:3
Reach Compliance Code:not_compliantECCN代码:EAR99
风险等级:5.17雪崩能效等级(Eas):120 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:55 V最大漏极电流 (Abs) (ID):66 A
最大漏极电流 (ID):66 A最大漏源导通电阻:0.017 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):138 W
最大脉冲漏极电流 (IDM):263 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

BUK9616-55A 数据手册

 浏览型号BUK9616-55A的Datasheet PDF文件第2页浏览型号BUK9616-55A的Datasheet PDF文件第3页浏览型号BUK9616-55A的Datasheet PDF文件第4页浏览型号BUK9616-55A的Datasheet PDF文件第5页浏览型号BUK9616-55A的Datasheet PDF文件第6页浏览型号BUK9616-55A的Datasheet PDF文件第7页 
Philips Semiconductors  
Product specification  
TrenchMOS transistor  
Logic level FET  
BUK9516-55A  
BUK9616-55A  
GENERAL DESCRIPTION  
QUICK REFERENCE DATA  
N-channel enhancement mode logic  
level field-effect power transistor in a  
plastic envelope available in  
TO220AB and SOT404 . Using  
trench’ technology which features  
very low on-state resistance. It is  
intended for use in automotive and  
SYMBOL  
PARAMETER  
MAX.  
UNIT  
VDS  
ID  
Ptot  
Tj  
Drain-source voltage  
Drain current (DC)  
Total power dissipation  
Junction temperature  
Drain-source on-state  
55  
66  
138  
175  
V
A
W
˚C  
RDS(ON)  
general  
purpose  
switching  
resistance  
V
GS = 5 V  
16  
15  
m  
mΩ  
applications.  
VGS = 10 V  
PINNING  
TO220AB & SOT404  
PIN CONFIGURATION  
SYMBOL  
PIN DESCRIPTION  
d
tab  
mb  
1
2
3
gate  
drain  
source  
g
2
1
3
1
2
3
TO220AB  
BUK9516-55A  
SOT404  
BUK9616-55A  
tab/mb drain  
s
LIMITING VALUES  
Limiting values in accordance with the Absolute Maximum System (IEC 134)  
SYMBOL PARAMETER  
CONDITIONS  
MIN.  
MAX.  
UNIT  
VDS  
Drain-source voltage  
Drain-gate voltage  
Gate-source voltage  
Non-repetitive gate-source voltage tp50µS  
-
-
-
-
-
55  
55  
10  
15  
V
V
V
V
VDGR  
±VGS  
±VGSM  
RGS = 20 kΩ  
-
ID  
ID  
IDM  
Ptot  
Tstg, Tj  
Drain current (DC)  
Drain current (DC)  
Drain current (pulse peak value)  
Total power dissipation  
Storage & operating temperature  
Tmb = 25 ˚C  
-
-
-
-
66  
46  
263  
138  
175  
A
A
A
W
˚C  
Tmb = 100 ˚C  
Tmb = 25 ˚C  
Tmb = 25 ˚C  
-
- 55  
THERMAL RESISTANCES  
SYMBOL PARAMETER  
CONDITIONS  
TYP.  
MAX.  
UNIT  
Rth j-mb  
Rth j-a  
Rth j-a  
Thermal resistance junction to  
mounting base  
Thermal resistance junction to  
ambient(TO220AB)  
Thermal resistance junction to  
ambient(SOT404)  
-
-
1.1  
K/W  
in free air  
60  
50  
-
-
K/W  
K/W  
Minimum footprint, FR4  
board  
May 2000  
1
Rev 1.000  

BUK9616-55A 替代型号

型号 品牌 替代类型 描述 数据表
BUK9616-55A,118 NXP

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