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BU9799KV PDF预览

BU9799KV

更新时间: 2024-10-28 06:44:39
品牌 Logo 应用领域
罗姆 - ROHM 驱动器
页数 文件大小 规格书
23页 695K
描述
For 200 Segment type LCD LCD Segment Driver

BU9799KV 技术参数

是否Rohs认证: 符合生命周期:Active
零件包装代码:QFP包装说明:LFQFP,
针数:64Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.39.00.01
风险等级:5.68数据输入模式:SERIAL
显示模式:SEGMENT接口集成电路类型:LIQUID CRYSTAL DISPLAY DRIVER
JESD-30 代码:S-PQFP-G64长度:10 mm
复用显示功能:NO功能数量:1
区段数:50端子数量:64
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:LFQFP
封装形状:SQUARE封装形式:FLATPACK, LOW PROFILE, FINE PITCH
峰值回流温度(摄氏度):NOT SPECIFIED认证状态:Not Qualified
座面最大高度:1.6 mm最大供电电压:5.5 V
最小供电电压:2.5 V标称供电电压:3.3 V
电源电压1-最大:5.5 V电源电压1-分钟:2.5 V
电源电压1-Nom:5 V表面贴装:YES
温度等级:INDUSTRIAL端子形式:GULL WING
端子节距:0.5 mm端子位置:QUAD
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:10 mm
最小 fmax:0.092 MHzBase Number Matches:1

BU9799KV 数据手册

 浏览型号BU9799KV的Datasheet PDF文件第6页浏览型号BU9799KV的Datasheet PDF文件第7页浏览型号BU9799KV的Datasheet PDF文件第8页浏览型号BU9799KV的Datasheet PDF文件第10页浏览型号BU9799KV的Datasheet PDF文件第11页浏览型号BU9799KV的Datasheet PDF文件第12页 
Cautions on use  
(1) Absolute Maximum Ratings  
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices,  
thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings  
is assumed, consideration should be given to take physical safety measures including the use of fuses, etc.  
(2) Operating conditions  
These conditions represent a range within which characteristics can be provided approximately as expected. The electrical characteristics are guaranteed  
under the conditions of each parameter.  
(3) Reverse connection of power supply connector  
The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the reverse connection,  
such as mounting an external diode between the power supply and the IC’s power supply terminal.  
(4) Power supply line  
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard, or the digital block power  
supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for  
the digital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from  
impedance common to the wiring patterns. For the GND line, give consideration to design the patterns in a similar manner.  
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use  
an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of  
capacity dropout at a low temperature, thus determining the constant.  
(5) GND voltage  
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure  
no terminals are at a potential lower than the GND voltage including an actual electric transient.  
(6) Short circuit between terminals and erroneous mounting  
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore,  
if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal,  
the ICs can break down.  
(7) Operation in strong electromagnetic field  
Be noted that using ICs in the strong electromagnetic field can malfunction them.  
(8) Inspection with set PCB  
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure to discharge  
from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection process, be sure to turn OFF  
the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount  
it from the jig. In addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the  
transportation and the storage of the set PCB.  
(9) Input terminals  
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can  
cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention  
not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will  
operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power  
supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of  
electrical characteristics.  
(10) Ground wiring pattern  
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal  
GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to  
a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of  
external parts as well.  
(11) External capacitor  
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance  
due to DC bias and changes in the capacitance due to temperature, etc.  
(12) No Connecting input terminals  
In terms of extremely high impedance of CMOS gate, to open the input terminals causes unstable state. And unstable state brings the inside  
gate voltage of p-channel or n-channel transistor into active. As a result, battery current may increase. And unstable state can also causes  
unexpected operation of IC. So unless otherwise specified, input terminals not being used should be connected to the power supply or GND line.  
(13) Rush current  
When power is first supplied to the CMOS IC, it is possible that the internal logic may be unstable and rush current may flow  
instantaneously. Therefore, give special condition to power coupling capacitance, power wiring, width of GND wiring, and routing of connections.  
9/22  

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