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BSS138ZN3-0-T1-G PDF预览

BSS138ZN3-0-T1-G

更新时间: 2022-02-26 14:13:01
品牌 Logo 应用领域
全宇昕 - CYSTEKEC /
页数 文件大小 规格书
9页 481K
描述
50V N-Channel Enhancement Mode MOSFET

BSS138ZN3-0-T1-G 数据手册

 浏览型号BSS138ZN3-0-T1-G的Datasheet PDF文件第3页浏览型号BSS138ZN3-0-T1-G的Datasheet PDF文件第4页浏览型号BSS138ZN3-0-T1-G的Datasheet PDF文件第5页浏览型号BSS138ZN3-0-T1-G的Datasheet PDF文件第6页浏览型号BSS138ZN3-0-T1-G的Datasheet PDF文件第7页浏览型号BSS138ZN3-0-T1-G的Datasheet PDF文件第9页 
Spec. No. : C834N3  
Issued Date : 2017.11.29  
Revised Date :  
CYStech Electronics Corp.  
Page No. : 8/9  
Recommended wave soldering condition  
Product  
Peak Temperature  
Soldering Time  
5 +1/-1 seconds  
Pb-free devices  
260 +0/-5 °C  
Recommended temperature profile for IR reflow  
Profile feature  
Average ramp-up rate  
(Tsmax to Tp)  
Sn-Pb eutectic Assembly  
Pb-free Assembly  
3°C/second max.  
3°C/second max.  
Preheat  
Temperature Min(TS min)  
Temperature Max(TS max)  
Time(ts min to ts max)  
100°C  
150°C  
60-120 seconds  
150°C  
200°C  
60-180 seconds  
Time maintained above:  
Temperature (TL)  
Time (tL)  
183°C  
60-150 seconds  
240 +0/-5 °C  
217°C  
60-150 seconds  
260 +0/-5 °C  
Peak Temperature(TP)  
Time within 5°C of actual peak  
temperature(tp)  
10-30 seconds  
20-40 seconds  
Ramp down rate  
6°C/second max.  
6°C/second max.  
8 minutes max.  
6 minutes max.  
Time 25 °C to peak temperature  
Note : All temperatures refer to topside of the package, measured on the package body surface.  
BSS138ZN3  
CYStek Product Specification  

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