BD4157MUV

更新时间： 2024-01-15 05:49:22

品牌	Logo	应用领域
罗姆 - ROHM		外围驱动器驱动程序和接口开关接口集成电路电源开关
页数	文件大小	规格书
25页	501K
描述
Power Switch IC for ExpressCardTM

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BD4157MUV 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
零件包装代码：	QFN	包装说明：	HVQCCN,
针数：	20	Reach Compliance Code：	compliant
ECCN代码：	EAR99	HTS代码：	8542.39.00.01
风险等级：	5.84	Is Samacsys：	N
内置保护：	OVER CURRENT; THERMAL; UNDER VOLTAGE	接口集成电路类型：	BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 代码：	S-XQCC-N20	长度：	4 mm
功能数量：	1	端子数量：	20
最高工作温度：	100 °C	最低工作温度：	-40 °C
输出电流流向：	SOURCE AND SINK	封装主体材料：	UNSPECIFIED
封装代码：	HVQCCN	封装形状：	SQUARE
封装形式：	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	峰值回流温度（摄氏度）：	NOT SPECIFIED
认证状态：	Not Qualified	座面最大高度：	1 mm
最大供电电压：	3.6 V	最小供电电压：	3 V
标称供电电压：	3.3 V	表面贴装：	YES
温度等级：	INDUSTRIAL	端子形式：	NO LEAD
端子节距：	0.5 mm	端子位置：	QUAD
处于峰值回流温度下的最长时间：	NOT SPECIFIED	宽度：	4 mm
Base Number Matches：	1

BD4157MUV 数据手册

Technical Note

BD4157MUV

10. Electrical characteristics

The electrical characteristics in the Specifications may vary, depending on ambient temperature, power supply voltage,

circuit(s) externally applied, and/or other conditions. Therefore, please check all such factors, including transient

characteristics, that could affect the electrical characteristics.

11. Capacitors applied to input terminals

The capacitors applied to the input terminals (V3_IN, V3AUX_IN and V15_IN) are used to lower the output impedance

of the connected power supply. An increase in the output impedance of the power supply may result in destabilization

of input voltages (V3_IN, V3AUX_IN and V15_IN). It is recommended that a low-ESR capacitor be used, with a lower

temperature coefficient (change in capacitance vs. change in temperature), Recommended capacitors are on the order

of 0.1 μF for V3AUX_IN, and1 μF for V3_IN and V15_IN. However, they must be thoroughly checked at the

temperature and with the load range expected in actual use, because capacitor selection depends to a significant

degree on the characteristics of the input power supply to be used and the conductor pattern of the PC board.

12. Capacitors applied to output terminals

Capacitors for the output terminals (V3, V3_AUX, and V15), should be connected between each of the output terminals

and GND. A low-ESR, low temperature coefficient output capacitor is recommended-on the order of 1 μF for V3 and

V15 terminals, and 1μF less for V3_AUX. However, they must be thoroughly checked at the temperature and with the

load range expected in actual use, because capacitor selection depends to a significant degree on the temperature

and the load conditions.

13. Not of a radiation-resistant design.

14. Allowable loss (Pd)

With respect to the allowable loss, please refer to the thermal derating characteristics shown in the Exhibit, which serves

as a rule of thumb. When the system design causes the IC to operate in excess of the allowable loss, chip temperature

will rise, reducing the current capacity and decreasing other basic IC functionality. Therefore, design should always

enable IC operation within the allowable loss only.

15. Operating range

Basic circuit functions and operations are warranted within the specified operating range the working ambient

temperature range. Although reference values for electrical characteristics are not warranted, no rapid or extraordinary

changes in these characteristics are expected, provided operation is within the normal operating and temperature

range.

16. The applied circuit example diagrams presented here are recommended configurations. However, actual design

depends on IC characteristics, which should be confirmed before operation. Also, note that modifying external circuits

may impact static, noise and other IC characteristics, including transient characteristics. Be sure to allow sufficient

margin in the design to accommodate these factors.

17. Wiring to the input terminals (V3 IN, V3AUX IN, and V15 IN) and output terminals (V3, V3AUX and V15) of the built-in

FET should be carried out with special care. Using unnecessarily long and/or thin conductors may decrease output

voltage and degrade other characteristics.

18. Heatsink

The heatsink is connected to the SUB, which should be short-circuited to the GND. Proper heatsink soldering to the

PC board should enable lower thermal resistance.

www.rohm.com

2011.06 - Rev.A

22/24

1...19 20 212223 24 25

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