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BD3941T-E2

更新时间： 2024-02-09 14:00:48
品牌 Logo 应用领域
罗姆 - ROHM 局域网输出元件调节器
页数 文件大小 规格书
9页 660K
描述
Fixed Positive LDO Regulator, 5V, 0.9V Dropout, ROHS COMPLIANT, TO-220, 3 PIN

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BD3941T-E2 技术参数

生命周期：Active零件包装代码：SFM
包装说明：ROHS COMPLIANT, TO-220, 3 PIN针数：3
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01风险等级：5.69
最大回动电压 1：0.9 V最大输入电压：25 V
最小输入电压：6.2 VJESD-30 代码：R-XSFM-T3
功能数量：1端子数量：3
工作温度TJ-Max：150 °C最大输出电流 1：0.2 A
最大输出电压 1：5.1 V最小输出电压 1：4.8 V
标称输出电压 1：5 V封装主体材料：UNSPECIFIED
封装形状：RECTANGULAR封装形式：FLANGE MOUNT
认证状态：Not Qualified调节器类型：FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
表面贴装：NO端子形式：THROUGH-HOLE
端子位置：SINGLEBase Number Matches：1

BD3941T-E2 数据手册

 浏览型号BD3941T-E2的Datasheet PDF文件第2页浏览型号BD3941T-E2的Datasheet PDF文件第3页浏览型号BD3941T-E2的Datasheet PDF文件第4页浏览型号BD3941T-E2的Datasheet PDF文件第6页浏览型号BD3941T-E2的Datasheet PDF文件第7页浏览型号BD3941T-E2的Datasheet PDF文件第8页 
zThermal design  
TO252-3  
HRP5  
TO220FP-3  
2.0  
1.6  
2.0  
1.6  
25  
20  
IC mounted on a ROHM standard board  
Board size: 70 mm ×70 mm × 1.6mm  
θja = 104.2 (°C /W)  
IC mounted on a ROHM standard board  
Board size: 70 mm ×70 mm × 1.6mm  
θja = 78.1 (°C /W)  
(1)無限大放熱板使用時 θja=6.25( /W)  
(2)IC 単体時 θja=62.5(℃/W)  
(1)20W  
1.6W  
1.2W  
15  
10  
5
1.2  
0.8  
1.2  
0.8  
(2)2.0W  
0.4  
0
0.4  
0
0
0
25  
50  
75  
100  
125  
150  
0
25  
50  
75  
100  
125  
150  
0
25  
50  
75  
100  
125  
150  
AMBIENT TEMPERATURE: Ta [℃]  
AMBIENT TEMPERATURE: Ta [℃]  
AMBIENT TEMPERATURE: Ta [℃]  
Fig.19  
Fig.20  
Fig.21  
Refer to the dissipation reduction illustrated in Figs. 19 to 21 when using the IC in an environment where Ta ≥ 25°C. The characteristics of the IC  
are greatly influenced by the operating temperature. If the temperature exceeds the maximum junction temperature Tjmax, the elements of the IC  
may be damaged. It is necessary to give sufficient consideration to the heat of the IC in view of two points, i.e., the protection of the IC from  
instantaneous damage and the maintenance of the reliability of the IC in long-time operation.  
In order to protect the IC from thermal destruction, the operating temperature of the IC must not exceed the maximum junction temperature Tjmax.  
Fig. 19 illustrates the power dissipation/power reduction for the TO252 package. Operate the IC within the power dissipation Pd. The following  
method is used to calculate the power consumption Pc (W).  
Pc = (Vcc − Vo) × Io + Vcc × Icc  
Power dissipation Pd ≤ Pc  
Vcc: Input voltage  
Vo: Output voltage  
Io: Load current  
Icc: Total supply current  
The load current Io is obtained to operate the IC within the power dissipation.  
Pd − Vcc × Icc  
Io ≤  
(Refer to Icc in Fig.12)  
Vcc − Vo  
The maximum load current Iomax for the applied voltage Vcc can be calculated during the thermal design process.  
Calculation example  
Example) Vcc = 12 V and Vo = 5.0 V at Ta = 85°C, BD3941FP  
0.624 −12 × Icc  
θja = 104.2°C/W → −9.6 mAW/°C  
25°C = 1.2 W → 85°C = 0.624 W  
Io ≤  
12 − 5  
Io ≤ 89 mA (Icc = 30 µA)  
Make a thermal calculation in consideration of the above equations so that the whole operating temperature range will be within the power  
dissipation. The power consumption Pc of the IC, in the event of shorting (i.e., if the Vo and GND pins are shorted), will be obtained from the  
following equation:  
Pc = Vcc × (Icc + Ishort)  
Ishort: Short current  
zExternal settings for pins and precautions  
1) Vcc pin  
Insert capacitors with a capacitance of 0.33 µF to 1,000 µF between the Vcc and GND pins.  
The capacitance varies with the application. Be sure to design the capacitance with a sufficient margin.  
2) Capacitors for stopping oscillation at output pins  
Capacitors for stopping oscillation must be placed between each output pin and the GND pin. Use a capacitor within a capacitance range  
between 1 µF and 1,000 µF. A ceramic capacitor with low ESR values, from 0.001 Ω to 100, can be used. Unstable input voltage and load  
fluctuations can affect output voltages. Output capacitor capacitance values should be determined for actual application.  
5/8  
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