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BCW29 PDF预览

BCW29

更新时间: 2024-11-08 22:27:23
品牌 Logo 应用领域
德欧泰克 - DIOTEC /
页数 文件大小 规格书
2页 124K
描述
Surface mount Si-Epitaxial PlanarTransistors

BCW29 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:,Reach Compliance Code:compliant
风险等级:5.56最大集电极电流 (IC):0.1 A
配置:Single最小直流电流增益 (hFE):120
湿度敏感等级:1最高工作温度:150 °C
极性/信道类型:PNP最大功率耗散 (Abs):0.3 W
子类别:Other Transistors表面贴装:YES
Base Number Matches:1

BCW29 数据手册

 浏览型号BCW29的Datasheet PDF文件第2页 
BCW 29, BCW 30  
PNP  
General Purpose Transistors  
Surface mount Si-Epitaxial PlanarTransistors  
PNP  
Si-Epitaxial PlanarTransistoren für die Oberflächenmontage  
Power dissipation – Verlustleistung  
250 mW  
±0.1  
Plastic case  
SOT-23  
1.1  
2.9  
0.4  
Kunststoffgehäuse  
(TO-236)  
3
Type  
Code  
Weight approx. – Gewicht ca.  
0.01 g  
2
1
Plastic material has UL classification 94V-0  
Gehäusematerial UL94V-0 klassifiziert  
1.9  
Standard packaging taped and reeled  
Standard Lieferform gegurtet auf Rolle  
Dimensions / Maße in mm  
1 = B 2 = E 3 = C  
Maximum ratings (TA = 25C)  
Grenzwerte (TA = 25C)  
BCW 29, BCW 30  
32 V  
Collector-Emitter-voltage  
Collector-Base-voltage  
Emitter-Base-voltage  
Power dissipation – Verlustleistung  
Collector current – Kollektorstrom (DC)  
B open  
E open  
C open  
- VCE0  
- VCB0  
- VEB0  
Ptot  
32 V  
5 V  
250 mW 1)  
100 mA  
- IC  
Peak Collector current – Kollektor-Spitzenstrom - ICM  
200 mA  
Peak Base current – Basis-Spitzenstrom  
Junction temperature – Sperrschichttemperatur  
Storage temperature – Lagerungstemperatur  
- IBM  
Tj  
TS  
200 mA  
150C  
- 65…+ 150C  
Characteristics (Tj = 25C)  
Kennwerte (Tj = 25C)  
Min.  
Typ.  
Max.  
Collector-Base cutoff current – Kollektorreststrom  
IE = 0, - VCB = 32 V  
- ICB0  
100 nA  
10 A  
IE = 0, - VCB = 32 V, Tj = 100C  
Emitter-Base cutoff current – Emitterreststrom  
IC = 0, - VEB = 5 V  
- ICB0  
- IEB0  
100 nA  
Collector saturation volt. – Kollektor-Sättigungsspg. 2)  
- IC = 10 mA, - IB = 0.5 mA  
- IC = 50 mA, - IB = 2.5 mA  
- VCEsat  
- VCEsat  
80 mV  
150 mV  
300 mV  
1
2
)
)
Mounted on P.C. board with 3 mm2 copper pad at each terminal  
Montage auf Leiterplatte mit 3 mm2 Kupferbelag (Lötpad) an jedem Anschluß  
Tested with pulses tp = 300 s, duty cycle 2% – Gemessen mit Impulsen tp = 300 s, Schaltverhältnis 2%  
34  
01.11.2003  

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