Datasheet > BCP53HX

BCP53HX

更新时间： 2022-09-29 11:48:30

品牌	Logo	应用领域
其他 - ETC		/
页数	文件大小	规格书
16页	1266K
描述
TRANS PNP 80V 1A SC73

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BCP53HX 数据手册

BCP53H series

Nexperia

80 V, 1 A PNP medium power transistors

6. Thermal characteristics

Table 7.

Symbol

R_th(j-a)

Thermal characteristics

Parameter

Conditions

Min

Typ

Max

207

125

100

Unit

K/W

[1]

[2]

[3]

[4]

[5]

thermal resistance from junction to ambient

in free air

R_th(j-sp)

thermal resistance from junction to solder point

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated; mounting pad for collector 1 cm².

[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated; mounting pad for collector 6 cm².

[4] Device mounted on an FR4 PCB, 4-layer copper; tin-plated and standard footprint.

[5] Device mounted on an FR4 PCB, 4-layer copper; tin-plated; mounting pad for collector 1 cm².

aaa-023489

th(j-a)

(K/W)

duty cycle = 1

0.75

0.50

0.33

0.20

0.10

0.05

0.02

0.01

-5

-4

-3

-2

-1

(s)

FR4 PCB, single-sided copper, tin-plated and standard footprint

Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

BCP53H_SER

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Product data sheet

Rev. 1 — 21 July 2017

5 of 16

1 2 3 456 7 8...16

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