BC846A - BC848C
NPN SURFACE MOUNT SMALL SIGNAL TRANSISTOR
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Features
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Ideally Suited for Automatic Insertion
Complementary PNP Types Available (BC856-BC858)
For Switching and AF Amplifier Applications
Lead, Halogen and Antimony Free, RoHS Compliant
"Green" Device (Notes 3 and 4)
SOT-23
Dim
A
B
C
D
E
Min
0.37
1.20
2.30
0.89
0.45
1.78
2.80
0.013
0.903
0.45
0.085
0°
Max
0.51
1.40
2.50
1.03
0.60
2.05
3.00
0.10
1.10
0.61
0.180
8°
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Qualified to AEC-Q101 Standards for High
Reliability
Mechanical Data
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Case: SOT-23
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminals: Solderable per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed over
Alloy 42 leadframe).
Pin Connections: See Diagram
Marking Information: See Page 4
Ordering Information: See Page 4
Approximate Weight: 0.008 grams
G
H
J
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K
L
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M
α
All Dimensions in mm
Marking Code (Note 2)
Type
Marking
1A, K1Q
Type
Marking
1G, K1M
BC846A
BC846B
BC847A
BC847B
BC847C
BC848A
BC848B
BC848C
1B, K1R
1J, K1J, K1E, K1Q
1K, K1K, K1F, K1R
1L, K1L, K1M
1E, K1E, K1Q
1F, K1F, K1R
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
80
50
30
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
BC846
BC847
BC848
VCBO
V
65
45
30
BC846
BC847
BC848
VCEO
V
V
6.0
5.0
BC846, BC847
BC848
VEBO
Collector Current
IC
ICM
100
200
mA
mA
Peak Collector Current
Peak Emitter Current
Power Dissipation (Note 1)
IEM
200
mA
Pd
300
mW
°C/W
°C
Thermal Resistance, Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
417
RθJA
Tj, TSTG
-65 to +150
Notes:
1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout
document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Current gain subgroup “C” is not available for BC846.
3. No purposefully added lead. Halogen and Antimony Free.
4. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code
V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS11108 Rev. 22 - 2
1 of 4
BC846A-BC848C
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